PRoCeSSoR
Processor Support
• Intel® Core™ i7 processors in the LGA2011 package
• Intel® Turbo Boost Technology2
• Intel® Hyper-Threading Technology3
• Integrated Memory Co ntroller with suppor t for up
to 64 GB4 of system memory DDR 3 2400+ O.C.
SDRAM
• Intel® Fast Memory Access
• Supports Intel® 64 architec ture6
CHIPSeT
Intel®X79ExpressChipset
• Intel® X79 PCH
• Intel® Rapid Storage Manager (RAID 0, 1, 5, 10)
• Two SATA (6.0 Gb/s) and four SATA (3.0 Gb/s) ports
• Two SATA (6.0 Gb/s) via Marvell controller
USB PoRTS
• Six Hi-Speed USB 2.0 ports via b ack panel
• Eight additional Hi -Speed USB 2.0 ports via fou r
internal headers
• Six Super-Speed USB 3.0 ports via NEC cont roller
SySTeM BIoS
• 64 Mb Flash EEPROM with Intel® Platform
Innovation Framework for E FI Plug and Play,
IDE drive auto-configure
• Advanced configurat ion and power interface
V3.0b, DMI 2.5
fAST BooT
• Fast boot
• Intel® Express BIOS up date support: BIOS up date
via F7 function key
Intel®DesktopBoardDX79SRExtremeSeriesTechnicalSpecications
HARDWARe MANAGeMeNT feATUReS
• Processor fan speed contro l
• System chassis fan speed control
• Voltage and temperature sensing
• Fan sensor inputs used to monitor f an activity
• Power management support for AC PI 3.0b
INTeL® PRo 10/100/1000
NeTWoRk CoNNeCTIoN
• Dual Intel® LAN on the back panel
• New low-power design ca n meet Energy Star*
5.0 specifications
eXPANSIoN CAPABILITIeS
• Three PCI Express* x16 connectors (configured
as x16/x16/x8 in Tri graphics mode)
• Two PCI Express 2.0 x1 slots
• One PCI slot
AUDIo
• 10-channel Intel® High D efinition Audio5 codec
• 8-channel via the back panel
• 2-channel via the front panel
• Back panel support for outp ut via optical cable
• One internal header fo r S/PDIF output for
HDMI* support
SySTeM MeMoRy
MemoryCapacity
• Eight 240-pin DIMM connectors supporting
quad channel memory. Two double- sided
DIMMS per channel
• Maximum system memory up to 64 GB7 using
8 GB double-sided DIMMs
MemoryTypes
• DDR3 2400+ O.C. SDRAM memory support
• Non-ECC Memory
MemoryModes
• Quad- or tri- or dual- or single-channel
operation support
MemoryVoltage
• 1.35 V low voltage
• 1.5 V standard JEDEC voltage
• Support for Intel® XMP extende d voltage profiles
JUMPeRS AND fRoNT PANeL Co NNeCToRS
Jumpers
• Single configuration jump er design
• Jumper access for BIOS maintenance m ode
Front Panel Connectors
• Reset, HD LED, Power LEDs, power on/off
• Four front-panel Hi-Speed USB 2.0 head ers
• One front-panel Super-Speed USB 3.0 header s
• Front-panel audio header
• One IEEE 1394a header
MeCHANICAL
Board Styl e
• ATX
Board Size
• 11.6¨ x 9.6¨ (29.46 cm x 24.38 cm)
BaseboardPowerRequirements
• ATX 12 V
eNvIRoNMeNT
OperatingTemperature
• 0° C to +55° C
Storage Temperature
• –20° C to +70° C
ReGULATIoNS AND SAfeT y STANDARDS
UnitedStatesandCanada
UL 1950, Third edition—C AN/CSA C22.2
No. 950-95 with recognized U.S. and Canadian
component marks
Europe
Nemko certif ied to EN 60950 Internationa l
Nemko certif ied to IEC 60950
(CB report wit h CB certificate)
eMC Regulations (tested in
representative chassis)
UnitedStates
FCC Part 15, Class B
FCC Part 15, Class B open-chas sis (cover off) testing
Canada
ICES-0 03, Class B
Europe
EMC directi ve 89/336/EEC; EN 55022:1998
Class B; EN 55024:1998
Australia/NewZealand
AS/NZS 35 48, Class B
Taiwa n
CNS 13438, Class B Internationa l
CISPR 22:1997, Class B
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