europe
Nemko certif ied to EN 60950 Internationa l
Nemko certif ied to IEC 60950
(CB report wit h CB certificate)
eMc regulations (tested in representative chass is)
united States
FCC Part 15, Class B
FCC Par t 15, Class B open-chassis (cover off ) testing
canada
ICES-0 03, Class B
europe
EMC directi ve 89/336/EEC; EN 55022:1998
Class B; EN 55024:1998
Australia/New Zealand
AS/NZS 35 48, Class B
taiwa n
CNS 13438, Class B Internationa l
CISPR 22:1997, Class B
Power requirements vary. Complies with US CRF via
EN55022 +6 db in system configurations with an
open chassis and EU Directive 89/336/EEC and use via
EN55022 and EN50082-1 in a representative chassis.
Lead-free: The symb ol is used to identify
electrical and elect ronic assemblies a nd com-
ponents in which the lead (Pb) concentration
level in any of the raw materials and th e end product
is not greater than 0.1% by weight (1000 ppm). This
symbol is also used to indica te conformance to lead-
free requirements and definitions adopted under
the European Union’s Restriction on Hazardous
Substances (RoHS) dire ctive, 2002/95/EC .
For ordering information, visit
www.intel.com
For the most current product information,
visit www.intel.com/go/idb
or http://ark.intel.com
For specific CPU compatibility, visit
http://processormatch.intel.com
ProceSSor
Processor Support
•Intel®Core™i7andIntel®Core™i5processorsinth e
LGA1156 package
•Intel®TurboBoostTechnology3
•Intel®Hyper-ThreadingTechnology4
•IntegratedMemoryControllerwiths upportforup
to 16 GB5 of system memory D DR3 1600+1 / 1333 /
1066 MHz SDRAM
•Intel®FastMemoryAccess
•SupportsIntel®64architec ture7
cHiPSet
New intel® P55 expr ess chipset
•Intel®82P55PlatformControllerHub(P CH)
•Intel®MatrixStorageTechnology(RAID0,1,5,10)
•EightonboardSATAports
•TwoeSATA(3.0Gb/s)portsonthebackpanel
provided by a Mar vell* 88SE6145 controller
uSb 2.0
integrated intel® PcH controller
•EightHi-SpeedUSB2.0portsviabackp anel
•Fouradditionalportsv iatwointernalheaders
•Oneonboardportviainternalh eader
System bioS
•16MbFlashEEPROMwithIntel®PlatformInn ovation
Framewor k for EFI Plug and Play, IDE dr ive auto-
configure
•Advancedconfigurationandpowe rinterface
V3.0b, DMI 2.5
intel® rapid bioS boot
•Intel®RapidBIOSBoot
•Intel®ExpressBIOSupdatesuppor t:BIOSupdate
via new F7 fun ction key
1
DDR3 1600 or higher memory support req uires compatible Intel® XMP- enabled memory or advanced kn owledge of BIOS and memory tunin g; individual results may vary. Alter ing PC memory frequency and /or
voltage may (i) reduc e system stabi lity and use lif e of the system, m emory and pro cessor; (ii ) cause the proc essor and oth er system compo nents to fail; ( iii) cause red uctions in sy stem perfor mance; (iv)
cause additional heat or other damage; and (v) affect sys tem data integrity. Intel assumes no respon sibility that the memory, includ ed if used with altered clock frequenci es and/or voltages, will be t for
any particular pur pose. Check w ith memory ma nufactur er for warrant y and additio nal details. F or specic sup ported mem ory for this mot herboard, p lease visit ww w.intel.com /go/idb for mo re details.
2 Intel® Desktop C ontrol Cente r is only compat ible with Inte l® Desktop Bo ards based on t he Intel® X38 Exp ress Chipset a nd newer. Auto-tu ning capabi lities may not be a vailable for al l Extreme Se ries motherb oards.
3 I ntel® Turbo Boost Technology re quires a PC with a proces sor with Intel Turbo Boost Technol ogy capability. Int el Turbo Boost Technology per formance varies de pending on hardwar e, software, and over all
system congurati on. Check wit h your PC manufa cturer on whe ther your syste m delivers Inte l Turbo Boost Technolo gy. See www.int el.com/tec hnology/tur boboost for m ore informat ion.
4 I ntel® Hyper-Threading Technolo gy requires a compute r system with a processo r supporting HT Techno logy and an HT Technology- enabled chipset , BIOS, and operatin g system. Perfor mance will vary
depending on the specic ha rdware and softwa re you use. For more infor mation including d etails on which proces sors support HT Techno logy, see www.intel. com/info/hype rthreading.
5 Sy stem resource s and hardware (su ch as PCI and PCI E xpress*) requ ire physical me mory addres s locations th at can reduce avai lable addres sable system m emory. This cou ld result in a red uction of as muc h
as 1 GB or more of physical a ddressable m emory being av ailable to the o perating sys tem and applic ations, depe nding on the sys tem congura tion and oper ating system.
6 I ntel® High Denitio n Audio requires a syste m with an appropriat e Intel® chipset and a moth erboard with an app ropriate codec and th e necessary driver s installed. System s ound quality will va ry depending
on actual impleme ntation, cont roller, codec, d rivers, and sp eakers. For mo re informatio n about Intel® H D Audio, refer to w ww.intel.co m/design/chi psets/hda udio.htm
7 6 4-bit comp uting on Intel ® architectu re requires a co mputer syste m with a process or, chipset, BIO S, operating s ystem, device d rivers, and a pplications e nabled for Int el® 64 archite cture. Proc essors will no t
operate (includi ng 32-bit operat ion) without an I ntel 64 archit ecture-e nabled BIOS. P erforman ce will vary dep ending on your h ardware and so ftware con gurations. S ee http://deve loper.intel.c om/techno logy/
intel64/index. htm for more inf ormation.
INFORMATION IN THIS DO CUMENT IS PROVIDE D IN CONNECTION WIT H INTEL® PRODUCTS. NO LIC ENSE, EXPRESS OR IM PLIED, BY ESTOPPEL OR OT HERWISE, TO ANY INT ELLECTUAL PROP ERTY RIGHTS IS
GRANTED BY THIS DOC UMENT. EXCEPT AS P ROVIDED IN INT EL’S TERMS AND CONDI TIONS OF SALE F OR SUCH PRODU CTS, INTEL A SSUMES NO LIA BILITY WH ATSOEVER, AND I NTEL DISCL AIMS ANY EXPR ESS
OR IMPLIED WARRAN TY, RELATING TO SAL E AND/OR USE OF IN TEL PRODUCT S INCLUDING L IABILITY O R WARRANTIE S RELATING TO FIT NESS FOR A PARTI CULAR PURP OSE, MERCHA NTABILITY, OR
INFRINGEMENT OF AN Y PATENT, COPYRIGHT, OR OTHE R INTELLEC TUAL PROPERT Y RIGHT.
Intel produc ts are not inten ded for use in me dical, life -saving, or li fe-sustain ing applicat ions. Intel ma y make changes to sp ecicatio ns and produc t descriptio ns at any time, wi thout notice .
All product s, dates, and gures speci ed are prelimi nary based o n current expe ctations, a nd are subject t o change with out notice. Avai lability in di fferent cha nnels may vary.
Actual Intel ® Desktop Boa rd may differ f rom the image sh own.
Intel, the Int el logo, Intel Co re, and Core Ins ide are trade marks of Intel C orporatio n in the U.S. and ot her countri es.
* Other name s and brands may b e claimed as th e property of o thers.
Copyright © 20 09 Intel Corpo ration. All r ights reser ved. 0709/AC/M S/PDF 322330-0 01US
Intel® Desktop Board DP55KG Extreme Series Technical SpecicationsHardware Management features
•Processorfanspeedcontrol
•Systemchassisfanspeedcontrol
•Voltageandtemperaturesensing
•Fansensorinputsusedtomonitorf anactivity
•PowermanagementsupportforAC PI3.0b
intel® Pro 10/100/1000 Network connection
•Newlow-powerdesigncanmeetEnergyStar*5.0
specifications
expansion capabilities
•OnePCIExpress*2.0x16slot,switchabletotwo
PCIExpress2.0x8slots
•OnePCIExpress2.0x4slot
•TwoPCIExpress2.0x1slots
•TwoPCIslots
Audio
•10-channelIntel®HighDefinitionAudi o6 codec
•8-channelviathebackpane l
•2-channelviathefrontpanel
•Backpanelsupportforbothi nputandoutput
via optical ca ble
•OneinternalheaderforS/PDIFo utputforHDMI*
support
SySteM MeMory
Memory capacity
•Four240-pinDIMMconnectorss upportingupto
two double -sided DIMMs
•Maximumsystemmemoryupto16GB5 using 4 GB
double-s ided DIMMs
Memory types
•DDR31600/1333/1066SDRAMmemorysupport
•Non-ECCMemory
Memory Modes
•Dual-orsingle-channelop erationsupport
Memory Voltage
•1.35Vlowvoltage
•1.5VstandardJEDECvoltage
•SupportforIntel®XMPextende dvoltageprofiles
JuMPerS ANd froNt-PANeL coNNectorS
Jumpers
•Singleconfigurationjumperde sign
•JumperaccessforBIOSmaintenancem ode
front-Panel connectors
•Reset,HDLED,PowerLEDs,poweron/off
•Twofront-panelHi-SpeedUSB2.0headers
•Front-panelaudioheader
•OneIEEE1394aheader
MecHANicAL
board Style
•ATX
board Size
•9.6”x11.6”(24.38cmx29.46cm)
baseboard Power requirements
•ATX12V
eNViroNMeNt
operating temperature
•0°Cto+55°C
Storage temperature
•-20°Cto+70°C
reGuLAtioNS ANd SAfety StANdArdS
united States and canada
UL 1950, Third edition— CAN/CSA C22.2
No. 950-95 with re cognized U.S. and Cana dian
component m arks