europe
Nemko certif ied to EN 60950 Internationa l
Nemko certif ied to IEC 60950
(CB report wit h CB certificate)
eMc regulations (tested in representative chass is)
united States
FCC Part 15, Class B
FCC Par t 15, Class B open-chassis (cover off ) testing
canada
ICES-0 03, Class B
europe
EMC directi ve 89/336/EEC; EN 55022:1998
Class B; EN 55024:1998
Australia/New Zealand
AS/NZS 35 48, Class B
taiwa n
CNS 13438, Class B Internationa l
CISPR 22:1997, Class B
Power requirements vary. Complies with US CRF via
EN55022 +6 db in system configurations with an
open chassis and EU Directive 89/336/EEC and use via
EN55022 and EN50082-1 in a representative chassis.
Lead-free: The symb ol is used to identify
electrical and elect ronic assemblies a nd com-
ponents in which the lead (Pb) concentration
level in any of the raw materials and th e end product
is not greater than 0.1% by weight (1000 ppm). This
symbol is also used to indica te conformance to lead-
free requirements and definitions adopted under
the European Union’s Restriction on Hazardous
Substances (RoHS) dire ctive, 2002/95/EC .

For ordering information, visit

www.intel.com

For the most current product information,

visit www.intel.com/go/idb

or http://ark.intel.com

For specific CPU compatibility, visit

http://processormatch.intel.com

ProceSSor
Processor Support
•Intel®Core™i7andIntel®Core™i5processorsinth e
LGA1156 package
•Intel®TurboBoostTechnology3
•Intel®Hyper-ThreadingTechnology4
•IntegratedMemoryControllerwiths upportforup
to 16 GB5 of system memory D DR3 1600+1 / 1333 /
1066 MHz SDRAM
•Intel®FastMemoryAccess
•SupportsIntel®64architec ture7
cHiPSet
New intel® P55 expr ess chipset
•Intel®82P55PlatformControllerHub(P CH)
•Intel®MatrixStorageTechnology(RAID0,1,5,10)
•EightonboardSATAports
•TwoeSATA(3.0Gb/s)portsonthebackpanel
provided by a Mar vell* 88SE6145 controller
uSb 2.0
integrated intel® PcH controller
•EightHi-SpeedUSB2.0portsviabackp anel
•Fouradditionalportsv iatwointernalheaders
•Oneonboardportviainternalh eader
System bioS
•16MbFlashEEPROMwithIntel®PlatformInn ovation
Framewor k for EFI Plug and Play, IDE dr ive auto-
configure
•Advancedconfigurationandpowe rinterface
V3.0b, DMI 2.5
intel® rapid bioS boot
•Intel®RapidBIOSBoot
•Intel®ExpressBIOSupdatesuppor t:BIOSupdate
via new F7 fun ction key
1
DDR3 1600 or higher memory support req uires compatible Intel® XMP- enabled memory or advanced kn owledge of BIOS and memory tunin g; individual results may vary. Alter ing PC memory frequency and /or
voltage may (i) reduc e system stabi lity and use lif e of the system, m emory and pro cessor; (ii ) cause the proc essor and oth er system compo nents to fail; ( iii) cause red uctions in sy stem perfor mance; (iv)
cause additional heat or other damage; and (v) affect sys tem data integrity. Intel assumes no respon sibility that the memory, includ ed if used with altered clock frequenci es and/or voltages, will be t for
any particular pur pose. Check w ith memory ma nufactur er for warrant y and additio nal details. F or specic sup ported mem ory for this mot herboard, p lease visit ww w.intel.com /go/idb for mo re details.
2 Intel® Desktop C ontrol Cente r is only compat ible with Inte l® Desktop Bo ards based on t he Intel® X38 Exp ress Chipset a nd newer. Auto-tu ning capabi lities may not be a vailable for al l Extreme Se ries motherb oards.
3 I ntel® Turbo Boost Technology re quires a PC with a proces sor with Intel Turbo Boost Technol ogy capability. Int el Turbo Boost Technology per formance varies de pending on hardwar e, software, and over all
system congurati on. Check wit h your PC manufa cturer on whe ther your syste m delivers Inte l Turbo Boost Technolo gy. See www.int el.com/tec hnology/tur boboost for m ore informat ion.
4 I ntel® Hyper-Threading Technolo gy requires a compute r system with a processo r supporting HT Techno logy and an HT Technology- enabled chipset , BIOS, and operatin g system. Perfor mance will vary
depending on the specic ha rdware and softwa re you use. For more infor mation including d etails on which proces sors support HT Techno logy, see www.intel. com/info/hype rthreading.
5 Sy stem resource s and hardware (su ch as PCI and PCI E xpress*) requ ire physical me mory addres s locations th at can reduce avai lable addres sable system m emory. This cou ld result in a red uction of as muc h
as 1 GB or more of physical a ddressable m emory being av ailable to the o perating sys tem and applic ations, depe nding on the sys tem congura tion and oper ating system.
6 I ntel® High Denitio n Audio requires a syste m with an appropriat e Intel® chipset and a moth erboard with an app ropriate codec and th e necessary driver s installed. System s ound quality will va ry depending
on actual impleme ntation, cont roller, codec, d rivers, and sp eakers. For mo re informatio n about Intel® H D Audio, refer to w ww.intel.co m/design/chi psets/hda udio.htm
7 6 4-bit comp uting on Intel ® architectu re requires a co mputer syste m with a process or, chipset, BIO S, operating s ystem, device d rivers, and a pplications e nabled for Int el® 64 archite cture. Proc essors will no t
operate (includi ng 32-bit operat ion) without an I ntel 64 archit ecture-e nabled BIOS. P erforman ce will vary dep ending on your h ardware and so ftware con gurations. S ee http://deve loper.intel.c om/techno logy/
intel64/index. htm for more inf ormation.
INFORMATION IN THIS DO CUMENT IS PROVIDE D IN CONNECTION WIT H INTEL® PRODUCTS. NO LIC ENSE, EXPRESS OR IM PLIED, BY ESTOPPEL OR OT HERWISE, TO ANY INT ELLECTUAL PROP ERTY RIGHTS IS
GRANTED BY THIS DOC UMENT. EXCEPT AS P ROVIDED IN INT EL’S TERMS AND CONDI TIONS OF SALE F OR SUCH PRODU CTS, INTEL A SSUMES NO LIA BILITY WH ATSOEVER, AND I NTEL DISCL AIMS ANY EXPR ESS
OR IMPLIED WARRAN TY, RELATING TO SAL E AND/OR USE OF IN TEL PRODUCT S INCLUDING L IABILITY O R WARRANTIE S RELATING TO FIT NESS FOR A PARTI CULAR PURP OSE, MERCHA NTABILITY, OR
INFRINGEMENT OF AN Y PATENT, COPYRIGHT, OR OTHE R INTELLEC TUAL PROPERT Y RIGHT.
Intel produc ts are not inten ded for use in me dical, life -saving, or li fe-sustain ing applicat ions. Intel ma y make changes to sp ecicatio ns and produc t descriptio ns at any time, wi thout notice .
All product s, dates, and  gures speci ed are prelimi nary based o n current expe ctations, a nd are subject t o change with out notice. Avai lability in di fferent cha nnels may vary.
Actual Intel ® Desktop Boa rd may differ f rom the image sh own.
Intel, the Int el logo, Intel Co re, and Core Ins ide are trade marks of Intel C orporatio n in the U.S. and ot her countri es.
* Other name s and brands may b e claimed as th e property of o thers.
Copyright © 20 09 Intel Corpo ration. All r ights reser ved. 0709/AC/M S/PDF 322330-0 01US
Intel® Desktop Board DP55KG Extreme Series Technical Specications
Hardware Management features
•Processorfanspeedcontrol
•Systemchassisfanspeedcontrol
•Voltageandtemperaturesensing
•Fansensorinputsusedtomonitorf anactivity
•PowermanagementsupportforAC PI3.0b
intel® Pro 10/100/1000 Network connection
•Newlow-powerdesigncanmeetEnergyStar*5.0
specifications
expansion capabilities
•OnePCIExpress*2.0x16slot,switchabletotwo
 PCIExpress2.0x8slots
•OnePCIExpress2.0x4slot
•TwoPCIExpress2.0x1slots
•TwoPCIslots
Audio
•10-channelIntel®HighDefinitionAudi o6 codec
•8-channelviathebackpane l
•2-channelviathefrontpanel
•Backpanelsupportforbothi nputandoutput
via optical ca ble
•OneinternalheaderforS/PDIFo utputforHDMI*
support
SySteM MeMory
Memory capacity
•Four240-pinDIMMconnectorss upportingupto
two double -sided DIMMs
•Maximumsystemmemoryupto16GB5 using 4 GB
double-s ided DIMMs
Memory types
•DDR31600/1333/1066SDRAMmemorysupport
•Non-ECCMemory
Memory Modes
•Dual-orsingle-channelop erationsupport
Memory Voltage
•1.35Vlowvoltage
•1.5VstandardJEDECvoltage
•SupportforIntel®XMPextende dvoltageprofiles
JuMPerS ANd froNt-PANeL coNNectorS
Jumpers
•Singleconfigurationjumperde sign
•JumperaccessforBIOSmaintenancem ode
front-Panel connectors
•Reset,HDLED,PowerLEDs,poweron/off
•Twofront-panelHi-SpeedUSB2.0headers
•Front-panelaudioheader
•OneIEEE1394aheader
MecHANicAL
board Style
•ATX
board Size
•9.6”x11.6”(24.38cmx29.46cm)
baseboard Power requirements
•ATX12V
eNViroNMeNt
operating temperature
•0°Cto+55°C
Storage temperature
•-20°Cto+70°C
reGuLAtioNS ANd SAfety StANdArdS
united States and canada
UL 1950, Third edition— CAN/CSA C22.2
No. 950-95 with re cognized U.S. and Cana dian
component m arks