LG Electronics 55LM960V-ZB FRC-III I/O for 3.3V, FRC-III AIP for 1.8V, FRC-III CORE for 0.9V, FRC-III DDR3 for 1.5V

THERMAL THERMAL
THERMAL
THERMAL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+1.5V
10K
R311
0.1uF
16V
C307
C333
22uF
10V
OPT
C310
10uF
25V
OPT
C318
22pF
50V
C315
22uF
10V
C331
22uF
10V
+1.8V
C314
22uF
10V
+3.3V
0.1uF
16V
C308
R301
22K
1%
C319
1uF
25V
+1.8V
C309
10uF
25V
OPT
C316
22uF
10V
C300
22pF
50V
R303
22K
1%
C306
0.1uF16V
C327
10uF
25V
OPT
C326
10uF
25V
C323
0.1uF16V
C313
10uF
25V
0.1uF
16V
C325
IC301
TPS54327DDAR
3
VREG5
2
VFB
4
SS
1
EN
5GND
6SW
7VBST
8VIN
9
[EP]GND
C311
10uF
25V
C312
22uF
10V
IC303
TPS54327DDAR
3
VREG5
2
VFB
4
SS
1
EN
5GND
6SW
7VBST
8VIN
9
[EP]GND
10K
R304
C305
0.1uF16V
C330
10uF
25V
C321
0.01uF
50V
VLCD_POWER
(+12V)
C302
1uF
25V
+3.3V
VLCD_POWER
(+12V)
+1.5V
10K
R305
IC300
TPS54327DDAR
3
VREG5
2
VFB
4
SS
1
EN
5GND
6SW
7VBST
8VIN
9
[EP]GND
+3.3V
C328
10uF
25V
OPT
VLCD_POWER
(+12V)
C301
1uF
25V
VLCD_POWER
(+12V)
L302
MLB-201209-0120P-N2 L306 MLB-201209-0120P-N2
L307
MLB-201209-0120P-N2
L303
MLB-201209-0120P-N2
C303
3300pF
50V
C335
100pF
50V
IC302
AOZ1038PI
3
AGND
2
VIN
4
FB
1
PGND
5COMP
6EN
7NC_1
8NC_2
9
[EP]LX
10K
R310
+3.3V C332
22uF
10V
C329
22uF
10V
+0.9V
R312
3.3K
C320
4700pF
50V
C336
3300pF
50V
OPT
C334
100pF
50V
OPT
+0.9V
0.1uF
16V
C322
C304
0.01uF
50V
R316
0
R308
68K
1%
R315
5.1K
1%
R314
3.6K
1%
R302
18K
1%
R309
22K
1%
R307
22K
1%
R313
0
R300
30K
1%
L305
3.6uH
NR8040T3R6N
L301
3.6uH
NR8040T3R6N
L300
3.6uH
NR8040T3R6N
L304
3.6uH
NR8040T3R6N
R306
4.7K
1%
POWER 3 6
Analog I/O Power +1.8V
Digital I/O Power +3.3V
DDR3PHY Power +1.5V
Core Power +0.9V
LG1122(FRC-III) Power up Sequence
FRC-III I/O for 3.3V
R2
tss(ms)=[C303(nF)*Vref]/Iss(uA)
R2
R2
R1
FRC-III AIP for 1.8V
Vout=0.765*(1+R1/R2)
Vout=0.765*(1+R1/R2)
R1R1
Vout=0.765*(1+R1/R2)
FRC-III CORE for 0.9V
FRC-III DDR3 for 1.5V
tss(ms)=[C304(nF)*Vref]/Iss(uA) tss(ms)=[C321(nF)*Vref]/Iss(uA)
MAX 0.345A
TYP 0.278A
MAX 1.184A
TYP 1.149A TYP 0.043A
MAX 0.046A
TYP 2.521A
Ton_DIO 20us(min)
Ton_DDR 40us(min)
Ton_CORE 40us(min)
MAX 3.124A
Vout=0.8*(1+R1/R2)
R2
R1
2011. 07. 05120Hz Back-End Board
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