CHAPTER 25 RECOMMENDED SOLDERING CONDITIONS
User’s Manual U15331EJ4V1UD 367
Table 25-1. Surface Mounting Type Soldering Conditions (2/3)
(3)
µ
PD78F9489GC-8BT: 80-pin plastic QFP (14x14)
Soldering Method Soldering Conditions Recommended
Condition Symbol
Interface reflow Package peak temperature: 235°C, Time:30 seconds max. (at 210°C or higher),
Count: Twice or less, Exposure limit: 7 daysNote (after that, prebake at 125°C for
10 hours)
IR35-107-2
VPS Package peak temperature: 215°C, Time:40 seconds max. (at 200°C or higher),
Count: Twice or less, Exposure limit: 7 daysNote (after that, prebake at 125°C for
10 hours)
VP15-107-2
Wave soldering Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120°C max. (package surface temperature)
WS60-107-1
Partial heating Pin temperature: 350°C max., Time: 3 seconds max. (per pin row) –
Note After opening the dry peak, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
(4)
µ
PD78F9489GK-9EU: 80-pin plastic TQFP (fine pitch) (12x12)
Soldering Method Soldering Conditions Recommended
Condition Symbol
Interface reflow Package peak temperature: 235°C, Time:30 seconds max. (at 210°C or higher),
Count: Twice or less, Exposure limit: 3 daysNote (after that, prebake at 125°C for
10 hours)
IR35-103-2
VPS Package peak temperature: 215°C, Time:40 seconds max. (at 200°C or higher),
Count: Twice or less, Exposure limit: 3 daysNote (after that, prebake at 125°C for
10 hours)
VP15-103-2
Partial heating Pin temperature: 350°C max., Time: 3 seconds max. (per pin row) –
Note After opening the dry peak, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).