CHAPTER 25 RECOMMENDED SOLDERING CONDITIONS
368 User’s Manual U15331EJ4V1UD
Table 25-1. Surface Mounting Type Soldering Conditions (3/3)
(5)
µ
PD789488GC-×××-8BT-A: 80-pin plastic QFP (14x14)
µ
PD78F9488GC-8BT-A: 80-pin plastic QFP (14x14)
µ
PD789489GC-×××-8BT-A: 80-pin plastic QFP (14x14)
µ
PD78F9489GC-8BT-A: 80-pin plastic QFP (14x14)
µ
PD789488GK-×××-9EU-A: 80-pin plastic TQFP (fine pitch) (12x12)
µ
PD78F9488GK-9EU-A: 80-pin plastic TQFP (fine pitch) (12x12)
µ
PD789489GK-×××-9EU-A: 80-pin plastic TQFP (fine pitch) (12x12)
µ
PD78F9489GK-9EU-A: 80-pin plastic TQFP (fine pitch) (12x12)
Soldering Method Soldering Conditions Recommended Condition
Symbol
Infrared reflow Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C
or higher), Count: Three times or less, Exposure limit: 7 daysNote (after
that, prebake at 125°C for 20 to 72 hours)
IR60-207-3
Wave soldering When the pin pitch of the package is 0.65 mm or more, wave soldering
can also be performed.
For details, contact an NEC Electronics sales representative.
−
Partial heating Pin temperature: 350°C max., Time: 3 seconds max. (per pin row) −
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Remarks 1. Products that have the part numbers suffixed by "-A" are lead-free products.
2. For soldering methods and conditions other than those recommended above, contact an NEC
Electronics sales representative.