Philips Semiconductors Product specification
Logic level TOPFET PIP3107-D
Fig.2. SOT428 surface mounting package1, centre pin connected to mounting base.
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT428 98-04-07
0 10 20 mm
scale
Plastic single-ended surface mounted package (Philips version of D-PAK); 3 leads
(one lead cropped) SOT428
E
b2D1
wAM
bc
b1
L1
L
13
2
D
E1
HE
L2
Note
1. Measured from heatsink back to lead.
e1
e
AA2
A
A1
y
seating plane
mounting
base
A1(1) D
max.
bD1
max. E
max.
HE
max. wy
max.
A2b2
b1
max. cE1
min. ee
1L1
min. L2
L
A
max.
UNIT
DIMENSIONS (mm are the original dimensions)
0.2 0.2
mm 2.38
2.22 0.65
0.45 0.89
0.71
0.89
0.71 1.1
0.9 5.36
5.26 0.4
0.2 6.22
5.98 4.81
4.45 2.285 4.57 10.4
9.6 0.5 0.7
0.5
6.73
6.47 4.0 2.95
2.55