
2002 Jul 03 3
Philips Semiconductors Product specification
MMIC wideband amplifier BGA2748
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134)
THERMAL RESISTANCE
CHARACTERISTICS
VS=3V; I
S= 5.7 mA; f = 1 GHz; Tj=25°C; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VSDC supply voltage RF input AC coupled −4V
I
Ssupply current −15 mA
Ptot total power dissipation Ts≤80 °C−200 mW
Tstg storage temperature −65 +150 °C
Tjoperating junction temperature −150 °C
PDmaximum drive power −10 dBm
SYMBOL PARAMETER CONDITIONS VALUE UNIT
Rth j-s thermal resistance from junction to solder
point Ptot = 200 mW; Ts≤80 °C 300 K/W
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
ISsupply current 4.5 5.7 8 mA
|s21|2insertion power gain f = 1 GHz −21.8 −dB
f = 2 GHz −18.5 −dB
RLIN return losses input f = 1 GHz −18 −dB
f = 2 GHz −14 −dB
RL OUT return losses output f = 1 GHz −7−dB
f = 2 GHz −8−dB
NF noise figure f = 1 GHz −1.9 −dB
f = 2 GHz −2.4 −dB
BW bandwidth at |s21|2−3 dB below flat gain at 1 GHz −1.9 −GHz
PL(sat) saturated load power f = 1 GHz −−2.3 −dBm
f = 2 GHz −−3.3 −dBm
PL 1 dB load power at 1 dB gain compression; f = 1 GHz −−9.2 −dBm
at 1 dB gain compression; f = 2 GHz −−10.9 −dBm
IP3(in) input intercept point f = 1 GHz −−23.7 −dBm
f = 2 GHz −−19.9 −dBm
IP3(out) output intercept point f = 1 GHz −−1.9 −dBm
f = 2 GHz −−1.4 −dBm