Philips BGA6489 MMIC wideband medium power amplifier, Philips Semiconductors, Package Outline

Philips Semiconductors	Product specification
MMIC wideband medium power amplifier	BGA6489
PACKAGE OUTLINE
Plastic surface mounted package; collector pad for good heat transfer; 3 leads	SOT89

D

b3

1	2
	b2
w M	b1
	e1

B

A

E

L

3

HE

c

								e
							0					2			4 mm
											scale
DIMENSIONS (mm are the original dimensions)
UNIT		A	b1	b2	b3	c	D		E	e			e1	HE	L	w
															min.
mm		1.6	0.48	0.53	1.8	0.44	4.6		2.6	3.0			1.5	4.25	0.8	0.13
		1.4	0.35	0.40	1.4	0.37	4.4		2.4					3.75
OUTLINE								REFERENCES									EUROPEAN	ISSUE DATE
VERSION				IEC			JEDEC					EIAJ					PROJECTION
	SOT89						TO-243				SC-62							97-02-28
																		99-09-13

2003 Sep 18 10