Philips Semiconductors Product specification

TOPFET high side switch BUK214-50Y
SMD version of BUK209-50Y
MECHANICAL DATA

Fig.4. SOT426 surface mounting package1, centre pin connected to mounting base.

REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT426
0 2.5 5 mm
scale

Plastic single-ended surface mounted package (Philips version of D2-PAK); 5 leads

(one lead cropped) SOT426

e e ee
E
b
A1
A
A1Lp
bcD
max. e
A
UNIT
DIMENSIONS (mm are the original dimensions)
E
11
mm 4.50
4.10 1.40
1.27 0.85
0.60 0.64
0.46 2.90
2.10
HD
15.80
14.80
Q
2.60
2.20
10.30
9.70
D1
1.60
1.20 1.70
98-12-14
99-06-25
1
3
24 5
mounting
base
D1
HD
D
Q
Lp
c

1 Epoxy meets UL94 V0 at 1/8". Net mass: 1.5 g.

For soldering guidelines and SMD footprint design, please refer to Data Handbook SC18.

September 2002 7 Rev 2.000