Philips BUK210-50Y, BUK215-50Y - page 12

Philips Semiconductors Product specification
TOPFET high side switch BUK215-50Y
SMD version of BUK210-50Y
MECHANICAL DATA
Fig.34. SOT426 surface mounting package1, centre pin connected to mounting base.
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT426
0 2.5 5 mm
scale
Plastic single-ended surface mounted package (Philips version of D2-PAK); 5 leads
(one lead cropped) SOT426
e e ee
E
b
A1
A
A1Lp
bcD
max. e
A
UNIT
DIMENSIONS (mm are the original dimensions)
E
11
mm 4.50
4.10 1.40
1.27 0.85
0.60 0.64 0.46 2.90 2.10
HD
15.80
14.80
Q
2.60
2.20
10.30
9.70
D1
1.60
1.20 1.70
98-12-14
99-06-25
1
3
24 5
mounting
base
D1
HD
D
Q
Lp
c
1 Epoxy meets UL94 V0 at 1/8". Net mass: 1.5 g.
For soldering guidelines and SMD footprint design, please refer to Data Handbook SC18.
May 2001 12 Rev 1.010