2004 Jan 28 2
Philips Semiconductors Product specification
22 W BTL or 2 × 11 W
stereo power amplifier TDA1519C
FEATURES
•Requires very few external components for Bridge-Tied
Load (BTL) operation
•Stereo or BTL application
•High output power
•Low offset voltage at output (important for BTL
applications)
•Fixed gain
•Good ripple rejection
•Mute/standby switch
•Load dump protection
•AC and DC short-circuit safe to ground and VP
•Thermally protected
•Reverse polarity safe
•Capability to handle high energy on outputs (VP=0V)
•No switch-on/switch-off plops
•Protected against electrostatic discharge
•Low thermal resistance
•Identical inputs (inverting and non-inverting)
•Pin compatible with TDA1519B (TDA1519C and
TDA1519CSP).
GENERAL DESCRIPTION
The TDA1519C is an integrated class-B dual output
amplifier in a 9-lead plastic single in-line power package or
20-lead heatsink small outline package.
For the TDA1519CTH (SOT418-3), the heatsink is
positioned on top of the package, which allows an external
heatsink to be mounted on top. The heatsink of the
TDA1519CTD (SOT397-1) is facing the PCB, allowing the
heatsink to be soldered onto the copper area of the PCB.
ORDERING INFORMATION
TYPE NUMBER PACKAGE
NAME DESCRIPTION VERSION
TDA1519C SIL9P plastic single in-line power package; 9 leads SOT131-2
TDA1519CSP SMS9P plastic surface mounted single in-line power package; 9 leads SOT354-1
TDA1519CTD HSOP20 plastic, heatsink small outline package; 20 leads SOT397-1
TDA1519CTH HSOP20 plastic, heatsink small outline package; 20 leads; low stand-off height SOT418-3