Philips TDA6800, TDA6800T March 1986 7, Philips Semiconductors Product specication, DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1, PACKAGE OUTLINES

March 1986 7
Philips Semiconductors Product specification
Video modulator circuit TDA6800
TDA6800T
PACKAGE OUTLINES
REFERENCES
OUTLINE
VERSION EUROPEAN PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT97-1 92-11-17
95-02-04
UNIT A
max. 12 b
1(1) (1) (1)
b2cD E e M Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min. A max. bmax.
w
ME e1
1.73
1.14 0.53 0.38 0.36 0.23 9.8 9.2 6.48 6.20 3.60 3.05 0.2542.54 7.62 8.25 7.80 10.0 8.3 1.154.2 0.51 3.2
inches 0.068
0.045 0.021 0.015 0.014 0.009
1.07
0.89
0.042
0.035 0.39 0.36 0.26 0.24 0.14 0.12 0.010.10 0.30 0.32 0.31 0.39 0.33 0.0450.17 0.020 0.13
b2
050G01 MO-001AN
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
8
1
5
4
b
E
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
pin 1 index
DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1