Philips TDA8440 November 1985 11, Philips Semiconductors Product specication, DIP18: plastic dual in-line package; 18 leads (300 mil) SOT102-1, PACKAGE OUTLINE

November 1985 11
Philips Semiconductors Product specification
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PACKAGE OUTLINE
REFERENCES
OUTLINE
VERSION EUROPEAN PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT102-1 93-10-14
95-01-23
UNIT A
max. 12 b
1(1) (1) (1)
b2cD E e M Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min. A max. bmax.
w
ME e1
1.40
1.14 0.53 0.38 0.32 0.23 21.8 21.4 6.48 6.20 3.9 3.4 0.2542.54 7.62 8.25 7.80 9.5 8.3 0.854.7 0.51 3.7
inches 0.055
0.044 0.021 0.015 0.013 0.009
1.40
1.14
0.055
0.044 0.86 0.84 0.26 0.24 0.15 0.13 0.010.10 0.30 0.32 0.31 0.37 0.33 0.0330.19 0.020 0.15
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
b2
e
D
A2
Z
18
1
10
9
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
DIP18: plastic dual in-line package; 18 leads (300 mil) SOT102-1