Philips TDA8559T Philips Semiconductors TDA8559T

Product data sheets Rev. 03 — 15 May 2006 9 of 36

Philips Semiconductors TDA8559T

Low-voltage stereo headphone ampliﬁer

OUT2 and OUT1 11 and 14

BUFFER 12

VP2 and VP1 15 and 16

Table 4. Internal circuits

…continued

Symbol Pin Equivalent circuit

VP1

buffer output

100 Ω

50 Ω

mgd108

VP1

buffer output

mgd109

VP2 VP1

mgd111

2 kΩ

Contents

Main 1. General description 2. Features 3. Applications TDA8559T Rev. 03 15 May 2006 Product data sheets Low-voltage stereo headphone amplier 4. Quick reference data 5. Ordering information Product data sheets Rev. 03 15 May 2006 3 of 36 6. Block diagram Fig 1. Block diagram 7. Pinning information 7.1 Pinning 7.2 Pin description Philips Semiconductors TDA8559T 8. Functional description 8.1 V/I converters 8.2 Output ampliers 8.3 Buffer 8.4 Dynamic quiescent controller 8.5 Stabilizer 8.6 Input logic 8.7 Reference 9. Internal circuitry Page Philips Semiconductors TDA8559T 10. Limiting values 11. Thermal characteristics 12. Characteristics = 25 In accordance with the Absolute Maximum Rating System (IEC 60134). V 13. Application information = 25 13.1 General V = 3 V; T 13.2 Heatsink design 13.3 Test conditions 13.4 Input congurations Fig 7. Soft mute Fig 5. Input conguration Fig 6. Input conguration Fig 3. Input conguration; with input capacitor Fig 4. Input conguration; without input capacitor VP< 6 V. VP< 6 V. Page Product data sheets Rev. 03 15 May 2006 15 of 36 13.12 Application 7: Line driver application Fig 8. Application 1; single-ended with loudspeaker capacitor 13.13 Application diagrams IN1 IN2 Fig 9. Application 2; single-ended to buffer (without loudspeaker capacitor) IN1 IN2 Fig 10. Application 3; improved single-ended to buffer (without loudspeaker capacitor) Fig 11. Application 4; BTL mono amplier VP = 1.9 V to 6 V. Fig 12. Application 5; line driver application Product data sheets Rev. 03 15 May 2006 20 of 36 VP = 6 V to 18 V. Fig 13. Application 6; line driver application VP = 6 V to 30 V. Fig 14. Application 7; line driver application 13.14 Printed-circuit board layout 13.15 Response curves for low input mode Top view component side. Fig 15. Printed-circuit board layout (1) High mode. (2) Low mode. Fig 18. THD as a function of Po (stereo headphone) Fig 19. THD as a function of frequency (stereo (1) VP = 12 V. (2) VP = 3 V and 6 V. (3) VP = 3 V, 6 V and 12 V. (1) VP = 3 V. (2) VP = 12 V. VP = 3 V, Vi = 20 mV. VP = 3 V, Vi = 20 mV. (stereo headphone) VP = 3 V, Rs = 0 , Vr = 0.2 V (RMS). (1) RL = 32 , THD = 10 %. (2) RL = 32 , THD = 0.5 %. (1) RL = 25 . (2) RL = 32 . f = 1 kHz. (1) VP = 3 V, RL = 25 . (2) VP = 5 V, RL = 25 . Fig 26. Total worst case power dissipation as a function of supply voltage (SE) (stereo Fig 27. THD as a function of Po (BTL mono) Fig 28. THD as a function of frequency (BTL mono) Fig 29. SVRR as a function of frequency (BTL mono) (1) VP = 3 V, RL = 25 , THD = 70 mW. (2) VP = 5 V, RL = 25 , THD = 150 mW. VP = 3 V, Rs = 0 , Vr = 0.2 V (RMS). 13.16 Response curves for high input mode (1) THD = 10 %, RL = 25 . (2) THD = 0.5 %, RL = 25 . (1) RL = 25 . (2) RL = 32 (1) RL = 32 , THD = 10 %. (2) RL = 32 , THD = 0.5 %. (1) RL = 25 . (2) RL = 32 . Fig 34. THD as a function of Po (stereo headphone) Fig 35. THD as a function of frequency (stereo VP = 10 V, Vi = 20 mV. VP = 10 V, Rs = 0 , Vr = 0.2 V (RMS). SVRR (dB) (1) VP = 12 V, RL = 1 k. (2) VP = 18 V, RL = 1 k. VP = 12 V, Vo = 1 V. driver) 14. Test information 14.1 Quality information is applicable. General Quality Specication for Integrated Circuits, SNW-FQ-611 The 15. Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 Fig 43. Package outline SOT109-1 (SO16) 16. Soldering 16.1 Introduction to soldering surface mount packages 16.2 Reow soldering 16.3 Wave soldering 16.4 Manual soldering Page 17. Revision history 18. Legal information 18.1 Data sheet status 18.2 Denitions 18.3 Disclaimers 18.4 Trademarks 20. Contents