2004 May 05 7
Philips Semiconductors Preliminary specification
Power stage 2 x 10 or 1 x 20 W class-D
audio amplifier TDA8928J
9 LIMITING VALUES
In accordance with the Absolute Maximum Rate System (IEC 60134).
Notes
1. Human Body Model (HBM); Rs= 1500 Ω; C = 100 pF.
2. Machine Model (MM); Rs=10Ω; C = 200 pF; L = 0.75 µH.
10 THERMAL CHARACTERISTICS
11 QUALITY SPECIFICATION
In accordance with
“SNW-FQ611” if this device is used as an audio amplifier.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VPsupply voltage −±30 V
VP(sc) supply voltage for
short-circuits across the load
−±30 V
IORM repetitive peak current in
output pins
−2A
Tstg storage temperature −55 +150 °C
Tamb ambient temperature −40 +85 °C
Tvj virtual junction temperature −150 °C
Vesd(HBM) electrostaticdischarge voltage
(HBM) note 1
all pins with respect to VDD (class 1a) −500 +500 V
all pins with respect to VSS (class 1a) −1500 +1500 V
all pins with respect to each other
(class 1a)
−1500 +1500 V
Vesd(MM) electrostaticdischarge voltage
(MM) note 2
all pins with respect to VDD (class B) −250 +250 V
all pins with respect to VSS (class B) −250 +250 V
all pins with respect to each other
(class B)
−250 +250 V
SYMBOL PARAMETER CONDITIONS VALUE UNIT
Rth(j-a) thermal resistance from junction to ambient in free air 40 K/W
Rth(j-c) thermal resistance from junction to case in free air 1.5 K/W