12
Figure 7 shows the recommended dimensions for the mount pad (footprint) for the user system with
an IC socket for a TFP-144 package (NQPACK144SE: manufactured by Tokyo Eletech
Corporation). Note that the dimensions in figure 7 are somewhat different from those of the actual
chip's mount pad.
Unit: mm
0.40 ± 0.05
0.40 X 35 = 14.00 ± 0.05
0.40 X 35 = 14.00 ± 0.05
0.2 ± 0.05
3.0 - Ø1.0
8.0
8.0
0.40 ± 0.05
15.10 MAX
19.10 min
Figure 7 Recommended Dimensions for Mount Pad