9
Figure 5 shows the recommended dimensions for the m ou n t pad (footprint) for the user sy st em with
an IC socket for an FP-100M package (IC149-100-054-B51: manufactured by YAMAICHI
ELECTRONICS Co., Ltd.). Note that the dimensions in figure 5 are somewhat different from those
of the actual chip's mount pad.
Unit: mm
0.50 ± 0.05 0.30 ± 0.05
0.5 x 24 = 12.00 ± 0.05
0.5 x 24 = 12.00 ± 0.05
13.80 (max.)
17.10 (min.)
0.50 ± 0.05
Figure 5 Recommended Dimensions for Mount Pad