9
2.4 Recommended Dimensions for User System Mount Pad (Footprint)
Figure 5 shows the recommended dimensions for the m ou n t pad (footprint) for the user sys tem with
an IC socket for a TFP-120 package (IC149-120-043-B51: manufactured by YAMAICHI
ELECTRONICS Co., Ltd). Note that the dimensions in figure 5 are somewhat different from those
of the actual chip's mount pad.
Unit: mm
0.40 ± 0.05 0.25 ± 0.05
0.40 × 29 = 11.60 ± 0.05
0.40 × 29 = 11.60 ± 0.05
13.80 (max.)
17.10 (min.)
0.40 ± 0.05
Figure 5 Recommended Dimensions for Mount Pad