Renesas M30620T2-RPD-E - page 43

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Chapter 5. Specifications

This chapter describes specifications of this product.

5.1 Specifications ..............................................................................................................................44

5.2 Operation Timing in Memory Expansion and Microprocessor Modes (5 V) .............................45

(1) Separate Bus, No-wait ..........................................................................................................45

(2) Separate Bus, With Wait, Accessing External Memory Area ..............................................47

(3) Multiplex Bus, With Wait, Accessing External Memory Area ............................................49

(4) Timing Requirements ...........................................................................................................51

5.3 Operation Timing in Memory Expansion and Microprocessor Modes (3 V) .............................53

(1) Separate Bus, No-wait ..........................................................................................................53

(2) Separate Bus, With Wait, Accessing External Memory Area ..............................................55

(3) Multiplex Bus, With Wait, Accessing External Memory Area ............................................57

(4) Timing Requirements ...........................................................................................................59

5.4 Electrical Characteristics .............................................................................................................61

5.5 Connection Diagram.................................................................................................................... 62

5.6 External Dimensions ...................................................................................................................64

(1) External Dimensions of Emulation Pod................................................................................ 64

(2) External Dimensions of Pitch Converter Board (FLX-100LCC) .........................................65

Contents

Main Page Preface To use the product properly Precautions for Safety When using outside Japan Contents Page Page Page Chapter 1. Precautions for Safety WARNING IMPORTANT CAUTION Note on Malfunctions in the PC4701 System WARNING Warning for Installation: Warnings for Use Environment: Caution to Be Taken for Modifying This Product: Cautions to Be Taken for This Product: Notes on Downloading Firmware: Notes on Target System: Note on Reset Input: Note on When the Emulator Debugger Ends: Notes on Watchdog Function: Note on DMA Transfer: Notes on Stack Area: Note on Address 0 Access: Note on Stop and Wait Modes: Note on Setting the Work Area: Notes on MAP References and Settings: Notes on Software Breaks and Hardware Breaks: Note on BRK Instruction: Note on HOLD* Input: Note on Software Reset: Note on Protect Resistor (PRC2): Note on Pullup Control Resistor: Note on NMI* Input: Note on Differences between Actual MCU and Emulator: Table 1.2 Differences of outputs between actual MCU and this product (when stopping program) Table 1.3 Differences of outputs between actual MCU and this product (in stop mode) Table 1.4 Differences of outputs between actual MCU and this product (in wait mode) Note on Switch Settings According to Operation Voltage: Page Chapter 2. Preparation 2.1 Terminology 2.2 Package Components 2.3 Other Tool Products Required for Development 2.4 Name of Each Part (1) System Configuration (2) Inside of Emulation Pod 2.5 When Using the Emulator for the First Time Page Chapter 3. Setting Up 3.1 Removing the Upper Cover When Removing the Upper Cover: Page Table 3.1 Switch settings of M30620T2-RPD-E (part 1) Table 3.2 Switch settings of M30620T2-RPD-E (part 2) Page 3.3 Selecting Clock Supply Notes on Changing the Clock Supply: (1) Using the Oscillator Circuit on Target System Notes on External Clock: Page (3) Replacing the Oscillator Circuit Boards 3.4 Connecting the PC4701 and Emulation Pod (1) Connecting the Cable to the PC4701 Note on Connecting the Cable: Note on Securing the Screws: Page 3.5 Connecting the Target System Notes on Connecting Target Systems: Page Page Chapter 4. Usage 4.1 Turning On the Power (1) Checking the Connection of the Emulator System (2) Turning On the Power Notes on Power Supply: Page 4.2 Downloading Firmware (1) When It is Necessary to Download Firmware (2) Downloading Firmware in Maintenance Mode Note on Downloading Firmware: 4.3 Self-check (1) Self-check Procedure (2) If an Error is Detected in the Self-check Note on Self-check: Page Page Chapter 5. Specifications 5.1 Specifications Table 5.1 lists the specifications of M30620T2-RPD-E. Table 5.1 Specifications of M30620T2-RPD-E 5.2 Operation Timing in Memory Expansion and Microprocessor Modes (5 V) (1) Separate Bus, No-Wait Figure 5.1 Memory expansion mode and microprocessor mode (no-wait) (2) Separate Bus, With Wait, Accessing External Memory Area Figure 5.2 Memory expansion mode and microprocessor mode (with wait) (3) Multiplex Bus, With Wait, Accessing External Memory Area Table 5.4 and Figure 5.3 show the bus timing in the memory expansion mode and the microprocessor Table 5.4 Memory expansion mode and microprocessor mode (with wait, multiplex bus) *1 Calculated by the following formulas accord- *2 Calculated by the following formulas accord- Figure 5.3 Memory expansion mode and microprocessor mode (with wait, multiplex bus) (4) Timing Requirements Figure 5.4 Timing requirements *1 Minimum 7 ns (The definition is different from that of actual MCUs. For details, see Figure 5.5.) Figure 5.5 Timing requirements 5.3 Operation Timing in Memory Expansion and Microprocessor Modes (3 V) (1) Separate Bus, No-Wait Figure 5.6 Memory expansion mode and microprocessor mode (no-wait) (2) Separate Bus, With Wait, Accessing External Memory Area Table 5.7 and Figure 5.7 show the bus timing in the memory expansion mode and the microprocessor Table 5.7 Memory expansion mode and microprocessor mode (with wait, external memory area) Figure 5.7 Memory expansion mode and microprocessor mode (with wait) (3) Multiplex Bus, With Wait, Accessing External Memory Area Table 5.8 and Figure 5.8 show the bus timing in the memory expansion mode and the microprocessor Table 5.8 Memory expansion mode and microprocessor mode (with wait, multiplex bus) *1 Calculated by the following formulas accord- *2 Calculated by the following formulas accord- Figure 5.8 Memory expansion mode and microprocessor mode (with wait, multiplex bus) (4) Timing Requirements Figure 5.9 Timing requirements Figure 5.10 Timing requirements 5.4 Electrical Characteristics Table 5.11 Electrical characteristics of M60081L-0142FP (P0 0 to P5 Page Page Page Page Page Page Chapter 6. Troubleshooting 6.1 Flowchart to Remedy the Troubles Figure 6.1 Flowchart to remedy the troubles See the user's manual of the emulator debugger. See, "3.4 Connecting the PC4701 and Emulation Pod" (page 33). 6.2 When the Emulator Debugger Does Not Start Up Properly (1) When the LED Display of PC4701 is Abnormal Table 6.1 LED's abnormal display and its checkpoints (2) Errors Occur When the Emulator Debugger Starts Up (When the target system is connected) Table 6.2 Checkpoints of errors when starting up the emulator debugger (target is connected) (3) Errors Occur When the Emulator Debugger Starts Up (When the target system is not connected) Table 6.3 Checkpoints of errors when starting up the emulator debugger (target is not connected) Set the time for starting up (0.2 Vcc to 0.8 Vcc) 1 s or less. 6.3 Operation Differs from That of PROM Version MCUs (1) Does Not Operate with Operating Frequencies (3.6 V to 5.5 V) Properly See the instruction manuals of the PC4701 and the emulator debugger. See "4.2 Downloading Firmware" (page 40). See "3.4 Connecting the PC4701 and Emulation Pod" (page 33). (4) Data Values of ROM Area at Power-on Are Different (5) HOLD* control (6) A-D Conversion Values are Different from Expected Values (7) Outputs of ALE, Address and Others are Different from Those of Actual MCUs Page Chapter 7. Maintenance and Guarantee 7.1 Maintenance 7.2 Guarantee 7.3 Repair Provisions 7.4 How to Request for Repair Note on Transporting the Product: