Renesas M37906T-PRB Contents

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Contents

Chapter 1. Precautions for Safety........................................................................................... 7

1.1 Safety Symbols and Meanings.............................................................................. 8

Warning for Installation................................................................................... 9

Warning for Use Environment.........................................................................9

Caution to Be Taken for Modifying This Product........................................... 9

Cautions to Be Taken for This Product ...........................................................9

Notes on Target System................................................................................. 10

Note on Reset Input from the Target System ................................................10

Notes on Stack Area ......................................................................................10

Note on MCU Files........................................................................................ 10

Notes on EMEM Dialog ................................................................................11

Note on Boot Mode........................................................................................11

Note on Breaks Used with Internal Resources ..............................................11

Note on Debug Monitor Area........................................................................ 11

Note on Interface with the Target System .....................................................12

Notes on Service-Life of the MCU's Internal Flash ROM ............................12

Note on Debug Commands during STP/WIT Instruction .............................12

Notes on Disabling Watchdog Function........................................................ 12

Note on Real-Time RAM Monitor ................................................................12

Note on Coverage Measurement....................................................................12

Note on Differences between Actual MCU and Emulator ............................13

Chapter 2. Preparation..........................................................................................................15

2.1 Terminology........................................................................................................ 16

2.2 Package Components ..........................................................................................17

2.3 Other Tool Products Required for Development ................................................17

2.4 System Configuration..........................................................................................18

Chapter 3. Setting Up ...........................................................................................................19

3.1 Switch Settings.................................................................................................... 20

3.2 A-D Conversion Bypass Capacitor..................................................................... 21

3.3 Connecting the Emulation Pod Main Unit.......................................................... 22

3.4 Connecting the Target System ............................................................................24