Siemens ERTEC200 - page 11

1.4 ERTEC 200 Package
The ERTEC 200 is supplied in an FBGA package with 304 pins. The distance between the pins is 0.8 mm. The
package dimensions are 19 mm x 19 mm.
Figure 2: ERTEC 200 Package Description
Soldering instructions for the ERTEC 200 can be found in the following documents:
/10/ Soldering instructions for lead-based block.
/11/ Soldering instructions for lead-free block.
/12/ Code description for soldering.
When working with modules, always take precautionary measures against electrostatic charge
(ESD – Electrostatic Sensitive Devices).
Copyright © Siemens AG 2007. All rights reserved. Page 11 ERTEC 200 Manual
Technical data subject to change Version 1.1.0