64-Pin Super I/O with LPC Interface

Package Outline

 

Figure 2 64 Pin TQFP Package Outline, 7X7X1.4 Body, 2 MM Footprint

 

 

Table 1 64 Pin TQFP Package Parameters

 

 

 

 

 

 

 

 

 

MIN

 

NOMINAL

MAX

 

REMARKS

 

 

 

 

 

 

 

A

~

 

~

1.60

 

Overall Package Height

A1

0.05

 

~

0.15

 

Standoff

A2

1.35

 

1.40

1.45

 

Body Thickness

D

8.80

 

9.00

9.20

 

X Span

D1

6.80

 

7.00

7.20

 

X body Size

E

8.80

 

9.00

9.20

 

Y Span

E1

6.80

 

7.00

7.20

 

Y body Size

H

0.09

 

~

0.20

 

Lead Frame Thickness

L

0.45

 

0.60

0.75

 

Lead Foot Length

L1

~

 

1.00 REF.

~

 

Lead Length

e

0o

 

0.40 Basic

7o

 

Lead Pitch

 

 

~

 

Lead Foot Angle

 

 

 

 

 

 

 

W

0.13

 

0.18

0.23

 

Lead Width

ccc

~

 

~

0.08

 

Coplanarity

Notes:

1.Controlling Unit: millimeter.

2.Tolerance on the true position of the leads is ± 0.035 mm maximum.

3.Package body dimensions D1 and E1 do not include the mold protrusion.

Maximum mold protrusion is 0.25 mm per side. D1 and E1 dimensions determined at datum plane H.

4.4 Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.

5.5 Details of pin 1 identifier are optional but must be located within the zone indicated.

SMSC LPC47N217N 64TQFP

PRODUCT5 PREVIEW

Revision 0.2 (09-25-08)