– 21 –
CXP854P60
Package Outline Unit: mm
SONY CODE
EIAJ CODE
JEDEC CODE
23.9 ± 0.4
20.0 – 0.1
0.4 – 0.1
+ 0.15
14.0 – 0.1
119
20
32
33
51
52
64
0.15 – 0.05
+ 0.1
2.75 – 0.15
16.3
0.1 – 0.05
+ 0.2
0.8 ± 0.2
M
0.2
0.15
+ 0.4
17.9±0.4
+ 0.4
+ 0.35

64PIN QFP (PLASTIC)

QFP-64P-L01
P-QFP64-14x20-1.0
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
SOLDER PLATING
42/COPPER ALLOY
PACKAGE STRUCTURE
1.5g
1.0
0˚ to10˚
SONY CODE
EIAJ CODE
JEDEC CODE
23.9 ± 0.4
20.0 – 0.1
0.4 – 0.1
+ 0.15
14.0 – 0.1
119
20
32
33
51
52
64
0.15 – 0.05
+ 0.1
2.75 – 0.15
16.3
0.1 – 0.05
+ 0.2
0.8 ± 0.2
M
0.2
0.15
+ 0.4
17.9±0.4
+ 0.4
+ 0.35

64PIN QFP (PLASTIC)

QFP-64P-L01
P-QFP64-14x20-1.0
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
SOLDER PLATING
42/COPPER ALLOY
PACKAGE STRUCTURE
1.5g
1.0
0˚ to10˚
LEAD SPECIFICATIONSITEMLEAD MATERIAL ALLOY 42LEAD TREATMENT Sn-Bi 2.5%LEAD TREATMENT THICKNESS 5-18µmSPEC.

Sony Corporation