Multilayer Chip Baluns

For EGSM/Tx & Rx

HHM Series HHM1522B1

SHAPES AND DIMENSIONS

 

 

2.0±0.15

 

 

 

0.95±0.1

 

 

 

 

 

 

6

 

5

 

4

 

 

 

 

 

 

 

 

 

 

 

0.25

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

±0.15

 

 

 

 

 

 

1

 

2

 

3

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.25

 

 

0.1+ –0.2

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Terminal functions

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0.65±0.2

 

 

 

0.3±0.2

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1

Unbalanced port

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2

GND or DC feed+ RF GND

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

3

Balanced port

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

4

Balanced port

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

5

GND

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

6

N.C.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0.2

±

0.2

0.35±

0.2

 

 

 

Dimensions in mm

CIRCUIT DIAGRAM

6

5

4

Unbalanced

 

Balanced

input

 

output

50Ω

 

50Ω

1

2

3

RECOMMENDED PC BOARD PATTERNS

(1/2)

Conformity to RoHS Directive

0.30.2 This width is 50Ω.

Micro-strip line for 0.4mm thick glass-epoxy substrate.

0.8

6

 

0.6

 

0.8

1

 

5

2

4

3

 

 

 

 

ø0.3 Through-hole

0.3

 

 

 

 

 

 

 

 

 

Dimensions in mm

ELECTRICAL CHARACTERISTICS

Unbalanced impedance

50Ω

Balanced impedance

50Ω

Frequency range

880 to 960MHz

Unbalanced port return loss

12dB min.

Phase imbalance at balanced port

180±10deg.

Amplitude imbalance at balanced port

0±1.0dB

Insertion loss

1.3dB max.

Temperature range

Operating

–40 to +85°C

Storage

–40 to +85°C

 

Packaging style and quantities

2000pieces/reel

•Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.

•All specifications are subject to change without notice.

001-02 / 20080106 / e751_hhm1522b1.fm

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TDK HHM Series HHM1522B1 specifications Multilayer Chip Baluns For EGSM/Tx & Rx
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HHM Series HHM1522B1 specifications

The TDK HHM Series HHM1522B1 is a high-performance component designed for a variety of applications in modern electronics. This device is part of TDK's innovative lineup, known for its reliability and efficiency in power management and signal processing.

One of the main features of the HHM1522B1 is its compact design that integrates high power handling capabilities in a minimal footprint. This makes it ideal for applications where space is at a premium, such as smartphones, tablets, and compact industrial equipment. The device is engineered to operate effectively in environments with demanding thermal and electrical requirements.

The HHM1522B1 employs advanced technologies that enhance its performance and durability. One key technology is its use of high-quality ceramic materials, which contribute to excellent stability across a wide range of temperatures and frequencies. The ceramics used in this series allow for minimal losses, ensuring efficient operation even under heavy load conditions. Additionally, the HHM1522B1 is designed for high-frequency applications, making it suitable for use in RF circuits and high-speed data transmission systems.

In terms of characteristics, the HHM1522B1 excels in a variety of parameters. It offers a low Equivalent Series Resistance (ESR) and a high self-resonant frequency, making it capable of handling rapid voltage changes without significant halo effects. The device supports a wide voltage range, ensuring versatility across diverse power requirements and enhancing its utility in different electronic setups.

Moreover, the TDK HHM1522B1 is characterized by its robustness and longevity. The construction techniques utilized in this series lead to components that can withstand mechanical stress and environmental challenges, thus extending their operational lifespan. This quality is essential in applications where component failure can result in costly downtimes.

In summary, the TDK HHM Series HHM1522B1 combines compact size, high power handling capabilities, and advanced materials and technologies. Its low ESR, high-frequency performance, and robustness make it a preferred choice for designers and engineers who demand reliability and efficiency in their electrical components. Whether in consumer electronics or industrial applications, the HHM1522B1 stands out as a dependable solution that meets the evolving demands of modern technology.
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