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Texas Instruments 2004 2.4.4TPA2010D1 EVM PCB Layers, 4. TPA2010D1 EVM Top Layer, Operation2-7

Models: 2004

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TPA2010D1 EVM PCB Layers

2.4.4TPA2010D1 EVM PCB Layers

The following illustrations depict the TPA2010D1 EVM PCB layers and silk- screen. These drawings are not to scale. Gerber plots can be obtained from any TI sales office.

Figure 2−4. TPA2010D1 EVM Top Layer

Figure 2−5. TPA2010D1 EVM Bottom Layer

Operation2-7

Page 19

Image 19

Texas Instruments 2004 manual 2.4.4TPA2010D1 EVM PCB Layers, 4. TPA2010D1 EVM Top Layer, 5. TPA2010D1 EVM Bottom Layer

Contents

March TPA2010D1 Audio Power Amplifier Evaluation ModuleMixed-SignalProducts User’s GuideProducts IMPORTANT NOTICEApplications EVM IMPORTANT NOTICE EVM WARNINGS AND RESTRICTIONS Trademark Read This FirstInformation About Cautions and Warnings Related Documentation From Texas InstrumentsFCC Warning FCC WarningFigures ContentsTables Page Topic IntroductionChapter Page1.1 Feature Highlights 1.2 Description 1.3 TPA2010D1 EVM SpecificationsPage Topic OperationChapter Page2.1 Precautions Platform preparations 2.2 Quick Start List for PlatformPower supply Power Up2.3 Quick Start List for Stand-Alone References 2.4 ReferencesOperation2-5 10∝F 2.4.2TPA2010D1 EVM Schematic DiagramFigure 2−3. TPA2010D1 EVM Schematic Diagram Table 2−3. TPA2010D1 EVM Parts ListTPA2010D1 EVM PCB Layers 2.4.4TPA2010D1 EVM PCB LayersFigure 2−4. TPA2010D1 EVM Top Layer Figure 2−5. TPA2010D1 EVM Bottom Layer