The TPA311 MSOP Audio Power Amplifier Evaluation Module
3-4 Details

3.2.1 TPA311 Audio Amplifier IC

The TPA311 audio amplifier IC is a CMOS device intended primarily for bridge-
tied load (BTL) operation in battery-powered applications. It is supplied in a
very small surface-mount package and has been designed to operate from low
supply voltages (between approximately 2.5 V and 5.5 V) and deliver up to
approximately 350 mW into an 8-Ω, BTL (Figure 3–4). T ypical applications in-
clude portable phones, toys, games, and similar hand-held audio applications.

Figure 3–4. TPA311 Amplifier IC

5VO+
4
IN
VO–
8
_
_
+
+
7
2
VDD/2 VDD
GND
6
SE/BTL
Shutdown
3
1
Bypass
Bias
Control
The IC includes two separate internal amplifiers and can operate in either the
bridged-tied load (BTL) mode or the single-ended mode as selected by the
SE/BTL pin. In the BTL mode, the two amplifiers operate 180° out-of-phase
with each other for increased power. The speaker load is connected directly
across VO+ and VO–, and neither line is connected to ground. BTL operation
provides many benefits, including quadruple the output power of single-ended
operation and no need for bulky output coupling capacitors. In the single-
ended mode, one internal amplifier is turned off and the speaker load is
connected between the VO+ terminal, through an output coupling capacitor,
and system ground. For more information, see the TPA311 amplifier IC data
sheet, TI Literature Number SLOS207.

3.2.2 BTL Operation

To operate in the bridge-tied load output mode, the module SE/BTL control
input terminal must be held low. The module output signal from OUT+ must go
through the speaker load and be returned directly to OUT–, and not to system
ground. This requires that the OUT– line be isolated not only from system
ground, but also from the OUT– lines of any other amplifiers in the system. The
platform provides such isolated output lines from the amplifier EVM sockets
directly to separate left and right speaker connectors.