Technical Data | 481271850043 |
"PROGRAM 94"
1.Dimension
Height | 85 | cm |
Width | 59,4 | cm |
Depth | 60 | cm |
Weight | 53 | kg |
Wrapping | Shrink | film |
2.Specification !
Wafer consumption |
| 19,0 |
| I | |
Energy consumption |
| 1,5 |
| kW/h | |
Program | step |
| app. | 78 | min |
Noise level: |
|
|
|
| |
Range | B |
| 52 |
| dB (A) |
Range C |
| klo52 | dB (A) | ||
Detergent |
| ml | |||
Separate | contained | chamber | 1=113 | I1 = 2/3 | |
Salt consumption by | 21 ° dh | max. | 30 | gram | |
Hot wafer connection | see type.. | 60 |
| °C | |
Capacity |
|
| 12 |
| standard plaGe settings |
3. Volume |
|
|
|
|
|
Water |
|
|
|
|
|
Basic level |
| 1 ,5 |
| I | |
Working | level |
| 2,4 |
| I |
Dynamic | level |
| app. | 4,6 | I |
Safety level |
| 9,0 |
| I | |
| 12,5 |
| I | ||
Detergent |
| max. | 75 | gram | |
Clear rinse |
| 130 |
| cm3 | |
6 Dossier | steps |
|
| cm3 | |
Salt container |
| 2 |
| kg |
4.Flow Rates !Inlet Volumes
Spray pump |
| 70 | I 1 min | |
Drain pump |
| 16,5 | I 1 min | |
Wafer | inlet | elctrovalve | 5,5 | I |
5. Water | Pressure |
|
| |
Inlet pressure |
| bar | ||
Spray pump | pressure | 0,37 | bar |
6.Rotations
Spray pump motor | 2800 | r 1 min | ||
Drain pump | motor | 2800 | r 1 min | |
Spray | arm | lower | 57 j: 7 | r 1 min |
Spray | arm | upper | 34 j: 6 | r 1 min |