Z Microsystems - Multi Processor Unit
6.0 System Architecture Future Proof Technology Insertion
TranzPak 7 removable disk module
External connector transition board
DC Power In 
Quad modulated fan array provides front to back cooling
Fan array |
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| Switched | |
control |
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| peripheral | |
board |
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| and power | |
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| |
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| distribution |
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| backplane |
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(SCM) Sealed computer module stack
Peripheral clusters
