Reliability Guidelines Sheet 2 | Intel 5000 specs

Reference Thermal Solution

Table 6-2. Reliability Guidelines (Sheet 2 of 2)

Test (1)	Requirement	Pass/Fail Criteria (2)
Temperature Life	85°C, 2000 hours total, checkpoints at 168, 500,	Visual Check
	1000, and 2000 hours

Thermal Cycling	–5°C to +70°C, 500 cycles	Visual Check

Humidity	85% relative humidity, 55°C, 1000 hours	Visual Check

Notes:

1.It is recommended that the above tests be performed on a sample size of at least twelve assemblies from three lots of material.

2.Additional pass/fail criteria may be added at the discretion of the user.

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Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide

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Intel 5000 manual Reliability Guidelines Sheet 2

Contents

Thermal/Mechanical Design Guide Intel 5000 Series Chipset Memory Controller HubMCHPage Contents Figures Tables Revision Description Date Number Revision Table Design Flow Introduction Thermal Design Process Definition of Terms TDP Reference Documents Introduction Packaging Technology MCH Package Dimensions Top View Package Mechanical Requirements MCH Package Dimensions Bottom View Thermal Design Power TDP Thermal SpecificationsCase Temperature Intel 5000P Chipset MCH Thermal Specifications Intel 5000X Chipset MCH Thermal Specifications Thermal Simulation Thermal Simulation Thermal Metrology MCH Case Temperature MeasurementSupporting Test Equipment Thermocouple Attach Support Equipment Sheet 1 IHS Groove Thermal Calibration and ControlsThermocouple Attach Support Equipment Sheet 2 Description Part Number Calibration and Control Thermocouple Conditioning and Preparation IHS Groove Dimensions Bending the Tip of the Thermocouple Thermocouple Attachment to the IHS Thermocouple Bead Placement Position Bead on the Groove Step Applying the Adhesive on the Thermocouple Bead Curing Process 11. Removing Excess Adhesive from the IHS 10. Thermocouple Wire Management Groove Power Simulation Software Thermal Metrology Reference Thermal Solution Operating EnvironmentHeatsink Performance Mechanical Design Envelope Board-Level Components Keepout Dimensions Tall Torsional Clip Heatsink Board Component Keepout Tall Torsional Clip Heatsink Thermal Solution Assembly Retention Mechanism Component Keepout Zones Heatsink Orientation Mechanical Interface Material Extruded Heatsink ProfilesThermal Interface Material Heatsink Clip Clip Retention Anchors Reliability GuidelinesReliability Guidelines Sheet 1 Test Requirement Pass/Fail Criteria Reliability Guidelines Sheet 2 Reference Thermal Solution Reference Thermal Solution Motherboard Short Torsional Clip Heatsink Board Component Keepout Short Torsional Clip Heatsink Thermal Solution Assembly Short Torsional Clip Heatsink Assembly Heatsink Clip Reference Thermal Solution Part Intel Part Number Supplier Contact Information Tall Torsional Clip Heatsink Thermal Solution Short Torsional Clip Heatsink Thermal Solution Drawing Name Table B-1. Mechanical Drawing List Figure B-1. Tall Torsional Clip Heatsink Assembly Drawing Figure B-2. Tall Torsional Clip Heatsink Drawing Sheet 1 Figure B-3. Tall Torsional Clip Heatsink Drawing Sheet 2 Figure B-4. Tall Torsional Clip Heatsink Clip Drawing Figure B-5. Short Torsional Clip Heatsink Assembly Drawing Figure B-6. Short Torsional Clip Heatsink DrawingSheet 1 Figure B-7. Short Torsional Clip Heatsink DrawingSheet 2 Figure B-8. Short Torsional Clip Heatsink Clip Drawing Mechanical Drawings