Intel 5000 manual Reference Documents, Tdp

Introduction

Tcase_min

TDP

Minimum IHS temperature allowed. This temperature is measured at the geometric center of the top of IHS.

Thermal design power. Thermal solutions should be designed to dissipate this target power level. TDP is not the maximum power that the chipset can dissipate.

1.3Reference Documents

The reader of this specification should also be familiar with material and concepts presented in the following documents:

•Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guide

•Intel® 6700PXH 64-bit PCI Hub Datasheet

•Intel® 631xESB/632xESB I/O Controller Hub Thermal/Mechanical Design Guidelines

•Intel® 5000P/5000V/5000Z Chipset Memory Controller Hub (MCH) Datasheet

•Intel® 5000X Chipset Memory Controller Hub (MCH) Datasheet

•Dual-Core Intel® Xeon® Processor 5000 Series Datasheet

•Dual-Core Intel® Xeon® Processor 5000 Series Thermal/Mechanical Design Guidelines

•BGA/OLGA Assembly Development Guide

•Various system thermal design suggestions (http://www.formfactors.org)

Note:	Unless otherwise specified, these documents are available through your Intel field sales
	representative. Some documents may not be available at this time.

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Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide 9