Technical Speciﬁcations, Processor

Technical Speciﬁcations

Processor

Processor Support

•Intel® Core™2 Quad** processor in the LGA775 package

•Intel® Core™2 Duo processor in the LGA775 package

•Intel® Pentium® Dual-Core processor in the LGA775 package

•Intel® Celeron® 400 Sequence processor in the LGA775 package

•Supports Intel® 64 Architecture2

Chipset

Intel® G31 Express Chipset

•Intel® LE82G31 Graphics Memory Controller Hub (GMCH)

•Intel® 82801GB I/O Controller Hub (ICH7)

•Serial Peripheral Interface (SPI) Flash

Graphics Memory Controller Hub (GMCH)

•Designed to support up to 4 Gb1 of system memory using DDR2 800 / 667 SDRAM memory

•Intel® Fast Memory Access

•Intel® Graphics Media Accelerator X3100

Intel® I/O Controller Hub

•Ultra ATA 100/66 devices

•Four SATA (3.0 Gb/s) ports

•Integrated 10/100/1000 Network Connection

USB 2.0

Integrated Intel® ICH7 controllers:

•Four back-panel ports (two dual stack)

•Four additional ports (via two headers)

I/O Features

Integrated super I/O LPC bus controller

•Two PCI local bus slots

•One PCI Express* x1 local bus slot

System BIOS

•8 Mb Flash EEPROM with Intel® Platform Innovation Framework for EFI Plug and Play, IDE drive auto-conﬁgure

•Advanced conﬁguration and power interface V1.0b, DMI 2.0, multilingual support

System Memory

Memory Capacity

•Two 240-pin DIMM connectors supporting up to two double-sided DIMMs

Memory Types

•DDR2 800 / 667 SDRAM memory support

•Non-ECC Memory

Memory Modes

• Dual or single-channel operation support

Memory Voltage

• 1.8V

Hardware Management Features

•Processor fan speed control

•System chassis fan speed control

•Voltage and temperature sensing

•Fan sensor inputs used to monitor fan activity

•Power management support for ACPI 1.0b

Expansion Capabilities

•Two PCI bus add-in card connectors

•One PCI Express* x1 bus add-in card connector

•One PCI Express* x16 Graphics connector

Jumpers and Front-Panel Connectors

Jumpers

•Single conﬁguration jumper design

•Jumper access for BIOS maintenance mode

Front-Panel Connectors

•Reset, HD LED, Power LEDs, power on/off

•Two front-panel Hi-Speed USB 2.0 headers

•Front-panel audio header

•Front-panel serial header

Mechanical

Board Style

• ATX 2.2 compliant

Board Size

• 9.6” x 8.6” (24.38 cm x 21.84 cm)

Baseboard Power Requirements

• ATX12V

Environment

Operating Temperature

• 0° C to +55° C

Storage Temperature

• -40° C to +70° C

Regulations and Safety Standards

United States and Canada

CSA/UL 60950-1, First Edition

(Binational Standard)

Europe

(Low Voltage Directive 2006/95/EC) EN 60950-1:2006

International

IEC 60950-1:2001, First Edition

EMC Regulations

(tested in representative chassis) United States

FCC 47 CFR Part 15, Subpart B

Canada

ICES-003 Class B

Europe

(EMC Directive 2004/108/EC)

EN 55022:2006 and EN 55024:1998

Australia/New Zealand

EN 55022:2006 Class B

Japan

VCCI V-3/04.04, V-4/03.04, Class B

South Korea

KN-22:2005 and KN-24:2005

Taiwan

CNS 13438:2006 Class B

International

CISPR 22:2005 +A1:2005 +A2:2006 Class B

Environmental Compliance

Europe

Europe RoHS (Directive 2002/95/EC) China

China RoHS (MII Order # 39)

Lead-Free: The symbol is used to identify electrical and electronic assemblies and components in which the lead (Pb) concentration level in

any of the raw materials and the end product is not greater than 0.1% by weight (1000 ppm). This symbol is also used to indicate conformance to lead-free requirements and deﬁnitions adopted under the European Union’s Restriction on Haz- ardous Substances (RoHS) directive, 2002/95/EC.

Ordering Information: See the Intel Web site at www.intel.com

For the most current product information, visit developer.intel.com/design/motherbd/ For ENERGY STAR* recommended conﬁgurations, visit www.intel.com/go/energystar

1System resources (such as PCI and PCI Express*) require physical memory address locations that reduce available memory addresses above 3 GB. This may result in less than 4 GB of memory being available to the operating system and applications.

264-bit computing on Intel architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled for Intel® 64 architecture. Processors will not operate (including 32-bit operation) without an Intel 64 architecture-enabled BIOS. Performance will vary depending on your hardware and software conﬁgurations. See http://developer.intel.com/technology/intel64/index.htm for more information.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

Intel products are not intended for use in medical, life-saving, or life-sustaining applications. Intel may make changes to speciﬁcations and product descriptions at any time, without notice. All products, dates, and ﬁgures speciﬁed are preliminary based on current expectations, and are subject to change without notice. Availability in different channels may vary.

Intel, the Intel logo, Intel. Leap ahead., the Intel. Leap ahead. logo, Intel Core, Pentium, and Celeron are trademarks of Intel Corporation in the U.S. and other countries.

* Other names and brands may be claimed as the property of others.

** Supports 95W Thermal Design Power, Intel® Core™2 Quad Processors with 1066 MHz System Bus. For information, visit www.intel.com/go/ﬁndCPU

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