Intel DG33BU specifications Lead-Free Board Markings, Description Mark

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Intel Desktop Board DG33BU Technical Product Specification

Table 40 shows the various forms of the “Lead-Free 2nd Level Interconnect” mark as it appears on the board and accompanying collateral.

Table 40. Lead-Free Board Markings

Description

Mark

 

 

 

 

 

 

Lead-Free 2nd Level

 

 

 

 

 

 

 

 

Interconnect: This symbol is

 

 

 

 

used to identify electrical and

 

 

 

 

electronic assemblies and

 

 

 

 

components in which the lead

 

 

 

 

(Pb) concentration level in the

 

 

 

 

desktop board substrate and the

 

or

 

solder connections from the board

 

 

to the components (second-level

 

 

 

 

interconnect) is not greater than

 

 

 

 

0.1% by weight (1000 ppm).

 

 

 

 

 

 

 

 

 

or

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Contents DG33BU Revision History Revision Revision History DateTypographical Conventions Intended AudienceWhat This Document Contains Chapter DescriptionIntel Desktop Board DG33BU Technical Product Specification Other Common NotationContents Error Messages and Beep Codes Contents Product Certification Markings Board LevelViii Product Description What This Chapter ContainsFeature Summary Feature SummaryOverview Product Description For information about Refer toBoard Layout Major Board ComponentsBoard Components Shown in Figure Item/callout From Figure DescriptionBlock Diagram Block DiagramProcessor Legacy ConsiderationsOnline Support To find information about… Visit this World Wide Web siteSingle-sided Double-sided X8 Double-sided Type Technology Supported Memory ConfigurationsSystem Memory DIMMsMemory Configurations For information about… Refer toMemory Channel Configuration and Dimm Configuration Intel G33 Express Chipset Intel G33 Graphics SubsystemIntel Graphics Media Accelerator 3100 Graphics Controller Configuration Modes Dynamic Video Memory Technology DvmtAdvanced Digital Display ADD2/MEC Card Support Serial ATA Interfaces Intel Viiv Processor Technology3 USB Serial ATA SupportParallel IDE Controller Serial Port Interface Real-Time Clock SubsystemLegacy I/O Controller Diskette Drive InterfaceAudio Subsystem 3 PS/2 Keyboard and Mouse InterfaceAudio Jack Support Audio Connectors and Headers Audio Subsystem SoftwareItem Description LAN Subsystem Intel 82566DC Gigabit Ethernet ControllerLAN Subsystem Software 11.3 RJ-45 LAN Connector with Integrated LEDsLAN Connector LED States LED Color LED State ConditionFan Monitoring Hardware Management SubsystemHardware Monitoring and Fan Control Chassis Intrusion and DetectionThermal Monitoring Thermal Sensors and Fan HeadersPower Management Effects of Pressing the Power SwitchAcpi System States and Power States Power States and Targeted System PowerEnergy Star Wake-up Devices and EventsWake-up Devices and Events Power Connector Hardware SupportFan Headers LAN Wake CapabilitiesInstantly Available PC Technology 13.2.7 PME# Signal Wake-up SupportWAKE# Signal Wake-up Support Wake from USB13.2.9 +5 V Standby Power Indicator LED Location of the Standby Power Indicator LEDMemory Map Addressable MemoryDetailed System Memory Address Map System Memory Map Technical ReferenceAddress Range Decimal Hex Size Description Connectors and Headers Back Panel Connectors Back Panel ConnectorsComponent-side Connectors and Headers Component-side Connectors and HeadersComponent-side Connectors and Headers Shown in Figure Signal Tables for the Connectors and Headers Auxiliary Front Panel Power/Sleep LED Header Add-in Card ConnectorsAuxiliary Front Panel Power/Sleep LED Header Front Panel Audio HeaderPower Supply Connectors Processor Core Power ConnectorMain Power Connector Pin Signal Out Description Front Panel HeaderFront Panel Header Auxiliary Front Panel Power LED Header Connection Diagram for Front Panel USB Headers Front Panel USB HeadersBios Setup Configuration Jumper Settings Function/Mode Jumper Setting ConfigurationJumper Block Mechanical Considerations Form FactorElectrical Considerations Power Supply ConsiderationsRecommended Power Supply Current Values Output VoltageAdd-in Board Considerations Thermal ConsiderationsFan Header Current Capability Fan Header Current CapabilityLocalized High Temperature Zones Component Maximum Case Temperature ReliabilityThermal Considerations for Components Desktop Board DG33BU Environmental Specifications Parameter SpecificationEnvironmental Overview of Bios Features IntroductionPCI Autoconfiguration Bios Flash Memory OrganizationResource Configuration Bios Setup Program Menu BarSystem Management Bios Smbios Overview of Bios FeaturesPCI IDE Support Legacy USB Support Bios Updates Language SupportMedia Type Can be used for Bios recovery? Bios RecoveryAcceptable Drives/Media Types for Bios Recovery Custom Splash ScreenNetwork Boot Boot OptionsCD-ROM Boot Booting Without Attached DevicesAdjusting Boot Speed Peripheral Selection and ConfigurationBios Boot Optimizations Bios Security Features Supervisor and User Password FunctionsIntel Desktop Board DG33BU Technical Product Specification Bios Error Messages Bios Beep CodesBios Error Messages SpeakerPort 80h Post Codes Port 80h Post Code RangesRange Category/Subsystem Error Messages and Beep Codes Port 80h Post CodesPost Code Description of Post Operation BDS Waiting for user input Typical Port 80h Post Sequence Post Code DescriptionRegulatory Compliance Safety StandardsSafety Standards Standard TitleEuropean Union Declaration of Conformity Statement Disposal Considerations Regulatory Compliance and Battery Disposal InformationProduct Ecology Statements Recycling ConsiderationsEspañol Lead Free Desktop Board RussianLead-Free Board Markings Description MarkEMC Regulations EMC RegulationsRegulation Title Product Certification Markings Board Level Product Certification MarkingsBattery Disposal Information PrecautionPrecaución Awas Intel Desktop Board DG33BU Technical Product Specification