Philips TDA8943SF manual Package outline, SIL9MPF package outline

Page 8

Philips Semiconductors

TDA8943SF

 

7 W mono BTL audio amplifier

15. Package outline

 

 

 

SIL9MPF: plastic single in-line medium power package with fin; 9 leads

SOT110-1

D

D1

q

P

P1

 

 

 

A 3

 

 

 

q 2

 

 

 

q 1

 

 

 

A

planeseating

 

 

A 4

pin 1 index

 

 

 

 

 

 

 

 

L

 

1

 

9

Z

e

b

 

 

b2

b1

w M

 

 

 

 

0

5

10 mm

 

 

scale

 

DIMENSIONS (mm are the original dimensions)

A2

E

c

Q

UNIT

A

A 2

A3

A4

b

b 1

b 2

c

D

(1)

D1

E

(1)

e

L

P

P1

Q

q

q1

q2

w

Z (1)

max.

 

 

max.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

mm

18.5

3.7

8.7

15.8

1.40

0.67

1.40

0.48

21.8

21.4

6.48

2.54

3.9

2.75

3.4

1.75

15.1

4.4

5.9

0.25

1.0

17.8

8.0

15.4

1.14

0.50

1.14

0.38

21.4

20.7

6.20

3.4

2.50

3.2

1.55

14.9

4.2

5.7

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE

 

REFERENCES

 

 

 

EUROPEAN

ISSUE DATE

VERSION

IEC

JEDEC

 

EIAJ

 

 

PROJECTION

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SOT110-1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

92-11-17

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

95-02-25

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Fig 4. SIL9MPF package outline.

9397 750 04877

© Philips Electronics N.V. 1999. All rights reserved.

Preliminary specification

14 April 1999

8 of 12

Image 8
Contents Features General descriptionApplications Quick reference dataOrdering options Ordering informationPhilips Semiconductors Block diagram Block diagramPinning information PinningPower amplifier Mode selectionFunctional description Pin descriptionThermal characteristics Static characteristicsThermal characteristics Static characteristicsDynamic characteristics Dynamic characteristicsApplication diagram Application informationTest information Quality informationPackage outline SIL9MPF package outlineSoldering Revision historyData sheet status 19. Definitions DisclaimersPhilips Semiconductors a worldwide company For all other countries apply to Philips SemiconductorsContents