Philips Semiconductors | TDA8943SF |
| 7 W mono BTL audio amplifier |
16.Soldering
16.1Introduction to soldering through-hole mount packages
This text gives a brief insight to wave, dip and manual soldering. A more
Wave soldering is the preferred method for mounting of
16.2 Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the
immediately after soldering to keep the temperature within the permissible limit.
16.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
16.4 Package related soldering information
Table 9: Suitability of
Package | Soldering method |
|
| Dipping | Wave |
DBS, DIP, HDIP, SDIP, SIL | suitable | suitable [1] |
[1]For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
17.Revision history
Rev | Date | CPCN | Description |
01 | 990414 | - | Preliminary specification; initial version. |
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9397 750 04877 | © Philips Electronics N.V. 1999. All rights reserved. |
Preliminary specification | 14 April 1999 | 9 of 12 |