Philips TDA6107JF manual Soldering, Introduction to soldering through-hole mount packages

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Philips Semiconductors

Product specification

 

 

Triple video output amplifier

TDA6107JF

 

 

SOLDERING

Introduction to soldering through-hole mount packages

This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011).

Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board.

Soldering by dipping or by solder wave

The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joints for more than 5 seconds.

The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the

specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the temperature within the permissible limit.

Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to

10 seconds. If the bit temperature is between

300 and 400 °C, contact may be up to 5 seconds.

Suitability of through-hole mount IC packages for dipping and wave soldering methods

PACKAGE

 

SOLDERING METHOD

 

 

 

DIPPING

 

WAVE

 

 

 

 

 

 

DBS, DIP, HDIP, SDIP, SIL

suitable

 

suitable(1)

Note

1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

2002 Oct 18

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Contents Data Sheet Version FeaturesOrdering Information General Description Type Package Number NamePinning Symbol PIN Description Block DiagramHandling Symbol Parameter MIN MAX UnitQuality Specification Limiting ValuesThermal protection Thermal Characteristics Symbol Parameter ConditionsSymbol Parameter Conditions MIN TYP MAX Unit CharacteristicsPsrr Typical DC-to-DC transfer of VI to VOC 2002 Oct Tst Ov in % 150 Voc 100 Tor TPco 151 149 Tst 150 140 Voc 100 Tof TPco Bandwidth Switch-off behaviourCathode output Dissipation Flashover protectionTest circuit 2002 Oct Test and Application InformationInternal Circuitry Internal pin configuration 2002 OctPackage Outline TDA6107JFManual soldering SolderingIntroduction to soldering through-hole mount packages Soldering by dipping or by solder waveDisclaimers Data Sheet Status LevelDefinition DefinitionsTDA6107JF TDA6107JF TDA6107JF Contact information Philips Semiconductors a worldwide company

TDA6107JF specifications

The Philips TDA6107JF is a state-of-the-art video output integrated circuit (IC) designed for use in various consumer and professional electronics. It's particularly popular in television applications and display systems, showcasing advanced features that enhance image quality and performance.

One of the main features of the TDA6107JF is its ability to handle RGB video signals with exceptional fidelity. It supports a wide range of signal input levels, which makes it versatile for different types of video data. This allows devices using the IC to achieve vibrant colors and clear images, appealing to both casual viewers and professionals who demand high-quality video output.

The TDA6107JF incorporates sophisticated technologies including built-in amplification, enabling users to drive the display directly without needing additional external components. This integration simplifies circuit design, reducing the overall component count and potential points of failure within a system. As a result, manufacturers can create more compact and cost-effective designs while still delivering high performance.

In terms of characteristics, the TDA6107JF is distinguished by its low power consumption, which is essential for battery-operated devices. Enhanced efficiency also leads to reduced heat generation, ensuring longevity and reliability in performance. It operates over a wide voltage range, making it compatible with various power supply systems, which further broadens its applications.

Moreover, the TDA6107JF boasts excellent linearity and low distortion, which is crucial for maintaining the integrity of video signals during processing. This precision results in a clearer image with fewer artifacts, thereby enhancing the overall viewing experience.

Additionally, the TDA6107JF is equipped with features such as color burst extraction and adjustable gain settings, providing flexibility for different use cases. This means that manufacturers can tailor their devices to meet specific market needs or consumer preferences.

Overall, the Philips TDA6107JF represents a significant advancement in video output technology, merging functionality and performance in a single package. Its combination of features, efficiency, and reliability makes it an essential component in the world of display technology, underpinning its widespread adoption in modern electronic devices. As video and display standards evolve, the TDA6107JF continues to be a relevant and essential player in this competitive landscape.
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