Delta Electronics S48SA manual Thermal Considerations, Thermal Testing Setup, Thermal Derating

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THERMAL CONSIDERATIONS

THERMAL CURVES

Thermal management is an important part of the system design. To ensure proper, reliable operation, sufficient cooling of the power module is needed over the entire temperature range of the module. Convection cooling is usually the dominant mode of heat transfer.

Hence, the choice of equipment to characterize the thermal performance of the power module is a wind tunnel.

Thermal Testing Setup

Delta’s DC/DC power modules are characterized in heated vertical wind tunnels that simulate the thermal environments encountered in most electronics equipment. This type of equipment commonly uses vertically mounted circuit cards in cabinet racks in which the power modules are mounted.

The following figure shows the wind tunnel characterization setup. The power module is mounted on a test PWB and is vertically positioned within the wind tunnel. The space between the neighboring PWB and the top of the power module or a heat sink is 6.35mm (0.25”).

Thermal Derating

Heat can be removed by increasing airflow over the module. The module’s maximum hot spot temperature is 115. To enhance system reliability, the power module should always be operated below the maximum operating temperature. If the temperature exceeds the maximum module temperature, reliability of the unit may be affected.

Fiture 18: Hot spot temperature measured point

The allowed maximum hot spot temperature is defined at 115

S48SA05006(Standard) Output Current vs. Ambient Temperature and Air Velocity

Output Current(A)

@ Vin = 48V (Either Orienation)

7.0

 

6.0

600LFM

5.0

 

Natural

500LFM

Convection

 

4.0

 

100LFM

400LFM

3.0

 

 

200LFM

2.0

 

1.0

300LFM

 

FACING PWB

AIR VELOCITY

AND AMBIENT

TEMPERATURE

MEASURED BELOW

THE MODULE

AIR FLOW

PWB

MODULE

50.8 (2.0”)

0.0

 

 

 

 

 

 

 

 

65

70

75

80

85

90

95

100

105

 

 

 

 

 

 

 

Ambient Temperature ()

Figure 19: Output current vs. ambient temperature and air velocity @Vin=48V

10 (0.4”)

Note: Wind Tunnel Test Setup Figure Dimensions are in millimeters and (Inches)

Figure 17: Wind Tunnel Test Setup

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Contents Options Parameter Technical SpecificationsTypical input characteristics at room temperature Electrical Characteristics CurvesTurn-on transient at zero load current 2 ms/div. Top Scope Resistive Load Input Source Impedance Design ConsiderationFeatures Descriptions Circuit configuration for trim-down decrease output voltage Output Voltage Adjustment TrimThermal Testing Setup Thermal ConsiderationsThermal Derating Recommended PAD Layout SMD Pick and Place LocationLead Free SAC Process Recommend TEMP. Profile Leaded Sn/Pb Process Recommend TEMP. ProfileSMD Mechanical DrawingModel List Part Numbering System