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| SMX945 Condensed Manual V1.0A |
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| Physical Characteristics | Specification |
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| Dimensions | Length: | 117 mm +/- 0.1mm |
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| Depth: | 70 mm +/- 0.1mm |
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| Height: | 15 mm +/- 0.2mm (with 5mm bus connectors) |
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| 18 mm +/- 0.2mm (with 8mm bus connectors) |
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| The connector height is selected by the connector on the carrier board. |
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| Weight | 120 gr / 12 ounces |
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| PCB Thickness | 1.6 mm / 0.0625 inches nominal |
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| PCB Layer | Multilayer |
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| Operating Environment | Specification |
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| Relative Humidity |
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| Vibration | 5 to 2000 Hz |
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| Shock | 10 G |
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| Operating Temperature | Standard: T.B.D. (depends on the CPU and the cooling concept) |
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| Extended Range: T.B.D. |
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| Maximum Copper Temperature | 90°C |
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| Storage Temperature |
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EMI / EMC (IEC1131-2 refer MIL 461/462)
Specification
ESD Electro Static Discharge | IEC | |
| Metallic protection needed | |
| Separate Ground Layer included | |
| 15 kV single peak | |
REF Radiated Electromagnetic Field | IEC | |
| Not tested |
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EFT Electric Fast Transient (Burst) | IEC | |
| 250V - 4kV, 50 ohms, Ts=5ns | |
| Grade 2: 1KV Supply, 500 I/O, 5Khz | |
SIR Surge Immunity Requirements | IEC | |
| Supply: | 2kV, 6 pulse/minute |
| I/O: | 500V, 2 pulse/minute |
| FD, CRT: None | |
EN55022 |
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All information is subject to change without notice.
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