Texas Instruments UCC2891 manual EVM Assembly Drawing and Layout, Top Side Component Assembly

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EVM Assembly Drawing and Layout

8EVM Assembly Drawing and Layout

Figure 14 through Figure 20 show the top-side and bottom-side component placement for the EVM, as well as device pin numbers where necessary. A four layer PCB was designed using the top and bottom layers for signal traces and component placement along with an internal ground plane. The PCB dimensions are 3.6" x 2.7" with a design goal of fitting all components within the industry standard half-brick format, as outlined by the box dimensions 2.28" x 2.20" shown in Figure 15. All components are standard OTS surface mount components placed on the both sides of the PCB. The copper-etch for each layer is also shown.

Figure 14. Top Side Component Assembly

SLUU178A –November 2003 –Revised December 2006

Using the UCC2891 Active Clamp Current Mode PWM Controller

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Contents Users Guide Users Guide Description IntroductionApplications Schematic UCC2891EVM Electrical Performance SpecificationsUCC2891EVM Schematic Vout EVM Test SetupOutput Load LOAD1 Power Up/Down Test Procedures Overall Efficiency Output Current Input Ripple Voltage SR Gate Drive Top Side Component Assembly EVM Assembly Drawing and LayoutTop Side Silk Screen Internal Split Ground Plane Bottom Signal Trace Layer List of Materials List of MaterialsReferences EVM Important Notice Dynamic Warnings and Restrictions