3.3 PCB Fabrication Requirements and Stack Up
Notes:
1.PWB TO BE FABRICATED TO MEET OR EXCEED
2.BOARD MATERIAL AND CONSTRUCTION TO BE UL APPROVED AND MARKED ON THE FINISHED BOARD.
3.LAMINATE
4.COPPER WEIGHT: 1oz FINISHED
5.FINISHED THICKNESS: 0.062" +/- 0.010"
6.MIN PLATING THICKNESS IN THROUGH HOLES: .001"
7.SMOBC / HASL
8.LPI SOLDERMASK BOTH SIDES USING APPROPRIATE LAYER ARTWORK: COLOR = GREEN
9.LPI SILKSCREEN AS REQUIRED: COLOR = WHITE
10.VENDOR INFORMATION TO BE INCORPORATED ON BACK SIDE WHENEVER POSSIBLE
11.MINIMUM COPPER CONDUCTOR WIDTH IS: 0.009"
MINIMUM CONDUCTOR SPACING IS: 0.006"
12.NUMBER OF FINISHED LAYERS: 6
13.ALL 8 MIL HOLES TO BE PLUGGED AND COPLANAR TO SURFACE
14.SPACING BETWEEN LAYERS 1 AND 2 SHOULD BE 0.0075" SPACING BETWEEN LAYERS 2 AND 3 SHOULD BE 0.0075" SPACING BETWEEN LAYERS 4 AND 5 SHOULD BE 0.0075" SPACING BETWEEN LAYERS 5 AND 6 SHOULD BE 0.0075"
Stackup
Signal: Layer 1
0.0075"
GND: Layer 2 
0.0075"
VCC Power: Layer 3 
0.062"
VCCO1 Power: Layer 4
0.0075"
GND: Layer 5
0.0075"
SIGNAL/GND: Layer 6 