10/15 | TDK iQM Series manual

Data Sheet: SuperetaTM iQM Series –Single Output Quarter Brick

performance page for the power module of interest. In all conditions, the power module should be operated below the maximum operating temperature shown on

the derating curve. For improved design margins and enhanced system reliability, the power module may be operated at temperatures below the maximum rated operating temperature.

Heat transfer by convection can be enhanced by increasing the airflow rate that the power module experiences. The maximum output current of the power module is a function of ambient temperature (TAMB) and airflow rate as shown in the thermal performance figures on the thermal performance page for the power module of interest. The curves in the figures are shown for natural convection through 2 m/s (400 ft/min). The data for the natural convection condition has been collected at

0.3m/s (60 ft/min) of airflow, which is the typical airflow generated by other heat dissipating components in many of the systems that these types of modules are used in. In the final system configurations, the airflow rate for the natural convection condition can vary due to temperature gradients from other heat dissipating components.

Heatsink Usage: For applications with demanding environmental requirements, such as higher ambient temperatures or higher power dissipation, the thermal performance of the power module can be improved by attaching a heatsink or cold plate. The iQM platform is designed with a base plate with two M3 X 0.5 through- threaded mounting fillings for attaching a Heatsink or cold plate. The addition of a heatsink can reduce the airflow requirement; ensure consistent operation and extended reliability of the system. With improved thermal performance, more power can be delivered at a given environmental condition.

Standard heatsink kits are available from Innoveta Technologies for vertical module mounting in two different orientations

(longitudinal – perpendicular to the direction of the pins and transverse – parallel to the direction of the pins). The heatsink kit contains four M3 x 0.5 steel mounting screws and a precut thermal interface pad for improved thermal resistance between the power module and the heatsink. The screws should be installed using a torque- limiting driver set between 0.35-0.55 Nm (3- 5 in-lbs).

The system designer must use an accurate estimate or actual measure of the internal airflow rate and temperature when doing the heatsink thermal analysis. For each application, a review of the heatsink fin orientation should be completed to verify proper fin alignment with airflow direction to maximize the heatsink effectiveness. For TDK Innoveta standard heatsinks, contact TDK Innoveta Inc. for latest performance data.

©2004-2006 TDK Innoveta Inc.	℡ (877) 498-0099	10/15
iQM 1.5V/70A Datasheet 8/4/2006		10/15

iQM Series specifications

The TDK iQM Series represents a significant advancement in the realm of power inductors, catering specifically to applications that demand high efficiency and reliability. Designed for use in a variety of devices, including smartphones, tablets, and power supply systems, the iQM Series is tailored to meet the rigorous demands of modern electronics.

One of the standout features of the iQM Series is its compact size. The inductors are designed to maximize performance while minimizing space, making them ideal for applications where every millimeter counts. This compact design is achieved without compromising on performance, offering high inductance values that are essential for stable operation in power conversion circuits.

TDK has integrated innovative materials in the iQM inductors, utilizing a composite magnetic core that enhances energy efficiency and thermal performance. This ensures that the inductors operate effectively even at higher currents, reducing losses associated with heat generation. As a result, the iQM Series boasts a low DC resistance, contributing to improved overall system efficiency and enabling reliable operation in demanding environments.

Another notable characteristic of the iQM Series is its broad range of inductance values, which allows designers to select the most suitable inductor for their specific application requirements. This adaptability, combined with a wide operating temperature range, enables the iQM inductors to function efficiently in various climatic conditions and across different electronic devices.

Furthermore, the iQM Series is designed with a focus on minimizing noise. Advanced construction techniques have been employed to reduce electromagnetic interference, which is crucial for maintaining signal integrity in high-frequency applications. This makes the iQM Series particularly well-suited for power management circuits used in applications like DC-DC converters and power supply solutions.

The iQM Series also boasts impressive saturation current ratings, allowing for reliable performance even in peak current scenarios. This feature is essential for applications where transient loads can cause inductors to experience higher than normal currents. The ability to handle such conditions without saturating ensures longer device life and better performance under stress.

In summary, the TDK iQM Series of power inductors stands out due to its compact design, high efficiency, versatile inductance values, and effective noise reduction features. These qualities make iQM inductors an excellent choice for engineers looking to enhance their power management circuits in today's technologically advanced devices. With TDK's commitment to innovation and quality, the iQM Series is set to play a vital role in the future of electronics.