TDK iFA Series manual Thermal Management

Advance Data Sheet: MaxetaTM iFA Series

Thermal Management:

An important part of the overall system design process is thermal management; thermal design must be considered at all levels to ensure good reliability and lifetime of the final system. Superior thermal design and the ability to operate in severe application environments are key elements of a robust, reliable power module.

A finite amount of heat must be dissipated from the power module to the surrounding environment. This heat is transferred by the

The cross section of the airflow passage is rectangular with the space between the top of the module or heatsink (where applicable) and a parallel facing PCB is kept at a constant (0.5 in). The power module’s orientation with respect to the airflow direction can have a significant impact on the unit’s thermal performance.

Thermal De-rating:For proper application of the power module in a given thermal environment, output current de-rating curves are provided as a design guideline in the

three modes of heat transfer: convection, conduction and radiation. While all three modes of heat transfer are present in every application, convection is the dominant mode of heat transfer in most applications. However, to ensure adequate cooling and proper operation, all three modes should be considered in a final system configuration.

The open frame design of the power module provides an air path to individual components. This air path improves convection cooling to the surrounding environment, which reduces areas of heat concentration and resulting hot spots.

Test Setup: The thermal performance data of the power module is based upon measurements obtained from a wind tunnel test with the setup shown in the wind tunnel figure. This thermal test setup replicates the typical thermal environments encountered in

Module

Centerline

76 (3.0)

AIRFLOW

Adjacent PCB

A	12.7
I	(0.50)
R
F
L
O
W

most modern electronic systems with distributed power architectures. The electronic equipment in networking, telecom, wireless, and advanced computer systems operates in similar environments and utilizes vertically mounted printed circuit boards (PCBs) or circuit cards in cabinet racks.

The power module is mounted on a 0.062 inch thick, 6-layer, 2oz/layer PCB and is vertically oriented within the wind tunnel. Power is routed on the internal layers of the PCB. The outer copper layers are thermally decoupled from the converter to better simulate the customer’s application. This also results in a more conservative derating.

Air Velocity and Ambient	Air Passage
Temperature
	Centerline
Measurement Location

Wind Tunnel Test Setup Figure

Dimensions are in millimeters and (inches).

Thermal Performance section for the power module of interest. The module temperature should be measured in the final system configuration to ensure proper thermal management of the power module. For thermal performance verification, the module temperature should be measured at the location indicated in the thermal measurement location figure on the Thermal

©2005 TDK Innoveta Inc.		￿ (877) 498-0099
iFA Advance Datasheet	6/6/2005	10/18