Maxim HFRD-34.0 manual Evaluation/Use Notes, Layer Profile

compatibility of the reference design with a wider variety of DVI video cards.

11 Evaluation/Use Notes

This reference design aids designers and is not intended to replace the entire design process. The designer should evaluate the reference design and modify it, as necessary, to meet the specification for a particular project. The designer should also carefully consider safety and EMI issues related to the specific application.

Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.

12 Layer Profile

The HFRD-34.0 DVI KVM switch includes controlled-impedance transmission lines. The layer profile is based on the following assumptions:

1.Dielectric material is FR-4 with a dielectric constant of ~ 4.2.

2.0.5oz copper foil before platting.

3.For USB signal-transmission lines: 10mil W, 8mil S -> 90Ω Differential

4.For DVI signal-transmission lines: 8mil W, 8mil S -> 100Ω Differential

Table 2. HFRD-34.0 Layer Profile

	Dielectric
	Thickness	Copper	Layer
Layer	(inches)	Clad	Desc.
1		0.5	SIGNAL
	0.0081
2		0.5	PLANE
	0.005
3		0.5	SIGNAL
	0.0036
4		0.5	SIGNAL
	0.005
5		0.5	PLANE
	0.0088
6		0.5	SIGNAL
	0.005
7		0.5	PLANE
	0.0036
8		0.5	SIGNAL
	0.005
9		0.5	PLANE
	0.0081
10		0.5	SIGNAL

Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.

Reference Design HFRD-34.0 (Rev.3, 05/08)	Maxim Integrated Products
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