Cypress CY62136VN manual Thermal Resistance6, AC Test Loads and Waveforms, Data Retention Waveform

CY62136VN MoBL®

Thermal Resistance[6]

Parameter	Description	Test Conditions	TSOPII	FBGA	Unit
ΘJA	Thermal Resistance	Still Air, soldered on a 4.25 x 1.125 inch,	60	55	°C/W
	(Junction to Ambient)	4-layer printed circuit board
ΘJC	Thermal Resistance		22	16	°C/W
	(Junction to Case)

AC Test Loads and Waveforms

R1

VCC

OUTPUT

30 pF

INCLUDING

JIG AND

SCOPE

(a)

R1

VCC

OUTPUT

R2 5 pF

INCLUDING

JIG AND

SCOPE

(b)

	VCC Typ	ALL INPUT PULSES
			90%
	10%	90%			10%
R2	GND
	Rise Time:			Fall Time:
	1 V/ns			1 V/ns

(c)

Equivalent to: THÉVENIN EQUIVALENT

RTH

OUTPUT V

Parameters	Value	Unit
R1	1105	Ohms
R2	1550	Ohms
RTH	645	Ohms
VTH	1.75	Volts

Data Retention Characteristics (Over the Operating Range)

Parameter	Description			Conditions[9]	Min.	Typ.[2]	Max.	Unit
VDR	VCC for Data Retention				1.0			V
ICCDR	Data Retention Current	VCC = 1.0V,		> VCC − 0.3V,		0.5	7.5	∝A
			CE
		VIN > VCC − 0.3V or VIN < 0.3V,
tCDR[6]	Chip Deselect to Data				0			ns
	Retention Time
t [7]	Operation Recovery Time				70			ns
R

Data Retention Waveform

DATA RETENTION MODE

V	VCC(min.)	V	> 1.0 V	VCC(min.)
CC		DR
	tCDR			tR
CE

Note:

7.Full device operation requires linear VCC ramp from VDR to VCC(min) > 100 ms or stable at VCC(min) > 100 ms.

8.No input may exceed VCC + 0.3V

Document #: 001-06510 Rev. *A Page 4 of 12

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