Rockford Fosgate 5.3x manual DSM Discrete Surface Mount Technology

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◆DSM (Discrete Surface Mount) Technology

The DSM (Discrete Surface Mount) manufacturing process combines the advantages of both discrete components and integrated circuitry. Rockford Fosgate is the only American amplifier manufacturer to have invested millions into this process. DSM components differ from conventional discrete components in different ways. They are more compact, more rugged, and they efficiently dissipate generated heat. Using them wherever appropriate allows the advantages associated with discrete circuitry to be retained while also providing room for both highly advanced processing features and generous PC board copper paths where needed. Their short lead-out structures allow maximum audio performance and highest signal-to-noise ratios to be obtained in amplifiers of desirable package size without resorting to “amplifier-on-a-chip” shortcuts. These advantages are shown below in Figure 1.

Figure 1

PC

Board

Thru-Hole

Component

Solder Solder

PC

Board

Surface Mount

THE RESULT: Fewer connections, improved reliability, shorter signal paths, superior signal-to-noise ratio and awesome sonic performance.

◆NOMAD (NOn-Multiplying Advanced Decision)

All Rockford Fosgate amplifiers use an analog computer process to maximize safe output power under all operating conditions. The innovative NOMAD (NOn-Multiplying Advanced Decision) system is the most sophisticated version of this technique ever used, bringing previously unavailable levels of accuracy, stability, temperature immunity and reliability to this critical process. NOMAD makes advanced decisions based on device voltages to precisely control the awesome levels of current available in the output MOSFETs to safe values – but only when absolutely needed.

THE RESULT: Extremely fast protection system that always protects the amplifier and never degrades the sound.

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Contents Installation a n d O p e r a t i o n Channel w/crossoversPractice Safe Sound TA B L E O F CO N T E N T S T T I N G S T a R T E DAccessory Pack Technical Design FeaturesT R O D U C T I O N Mosfet Devices DSM Discrete Surface Mount Technology High Level Inputs 3X DE S I G N FE AT U R E S Signal Input Switches Power/Speaker Barrier StripLED Power Indicator Dual Extruded HeatsinksS TA L L AT I O N CO N S I D E R AT I O N S Mounting Location Trunk MountingBattery and Charging WI R I N G T H E SY S T E MCut Using Passive Crossovers Table of Crossover Component Values OhmsUS I N G T H E Xcard Customizing the XcardResistor Chart Butterworth Alignment Q =Xcard Access Configuration #3 Using the Signal Switching NetworkConfiguration #2 Front inputsConfiguration #5 Configuration #6Front inputs = Front, Rear Subwoofer outputs Configuration #1 Front inputs Subwoofer L Mono inputsConfiguration #2 Front inputs Factory Configuration #4 Mono Sub Input Front inputs Subwoofer L Mono inputsConfiguration #5 Front inputs Watts Total Power 3X Installation High Level Input Single Ended TypeHigh Level Input B.T.L. Type Factory Radio 100.7Power Connections Channel OperationChannel Mono Operation Sub Gain Control operates independentlySystem Diagrams Step #1Step #2 Step #3 Step #4 Front XCardSymptom Diagnosis Remedy TR O U B L E S H O O T I N GSpeaker Output Engine noise with Music About the Dynamic Power MeasurementsDY N a M I C PO W E R ME a S U R E M E N T S Listening to Loudspeakers Not ResistorsWhat is an Amplifier? Information Cubed3X Specifications Front/Rear Sub ChannelsATC Length of Warranty Limited WA R R a N T Y in F O R M AT I O NPage Introducción Utilizacion DEL Circuito DE Conmutacion DE SeñalConfiguración n6 Configuración n3Configuración n5 PosterioresUtilisation DU Réseau DE Commutation DU Signal Somme avant & arrière ArrièreBenutzen DES Signal Netzwerkes EinleitungBeispiel #6 Beispiel #3Beispiel #5 Vordere Eingänge = Vordere & HintereConfigurazione #2 IntroduzioneImpiegare LA Rete DI Selezione Degli Ingressi Ingressi anteriore ConfigurazioneConfigurazione #4 Ingresso sub mono Posteriore sommatiMade in the USA
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