Compaq dc7800 manual Technical Specifications Audio, High Definition Audio Type, Codec Audio Jacks

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QuickSpecs

HP Compaq dc7800 Business PC

Technical Specifications - Audio

High Definition Audio Type

Integrated

High Definition Stereo Yes – ADI 4-channel ADI 1884 codec

Codec

 

Audio Jacks

Front microphone-In (150-K ohm Input Impedance)

 

Rear Line-In/Microphone input (150-K ohm Input Impedance, function is

 

configurable by audio driver)

Rear Line-Out * (190 ohms Output Impedance, expects at least a 10-K ohm load)

Front Headphone-Out (0.5 Ohm Output Impedance, expects at least a 32 ohm load)

*Internal Speaker Amplifier is for Internal Speaker only. External Speakers need to be powered externally. Rear Line in audio port is re-taskable as Line-in or Microphone-in.

Multistreaming

Multistreaming can be enabled in the ADI control panel to allow

Capable

independent audio streams to be sent to/from the front and rear jacks.

Sampling

8 kHz – 192 kHz

Wavetable Syntheses

Yes – Uses OS soft wavetable

(software)

 

Analog Audio

Yes

Number of Channels

Stereo (Left & Right channels)

on Line-Out

 

(mono/stereo)

 

Internal Audio Speaker 1.5 W

Power Rating

Internal Speaker

Yes

External Speaker Jack Yes (Line-Out)

DA - 12744 Worldwide QuickSpecs — Version 13 — 12.14.2007

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Contents Ultra-slim Desktop OverviewSmall Form Factor Convertible Minitower At a Glance Model Key and Example Configurable Components Select Models localized by RegionsStandard Features and Configurable Components Ports 80% Efficient PowerSupply Technology Usdt SFF CMTIntel vPro Processor DDR2 Synch Dram NON-ECC Memory MemoryExpandability Memory ConfigurationsDimm Size Slot Channel a Channel B GB maximumPCIe x1 and PCIe x16 slots are Not accessible Hard Drives Quantity Supported Position ControllerSecurity Diskette DrivesOptical Drives Slimline Optical DrivesAudio WirelessModem GraphicsMiscellaneous After-Market Options availability may vary by region PC2-6400 DDR2, 800 MHz SODIMMs Non-ECC Memory DIMMs PC2-5300 DDR2, 667 MHz DIMMs Non-ECCPC2-5300 DDR2, 667 MHz SODIMMs Non-ECC PC2-6400 DDR2, 800 MHz DIMMs Non-ECCSoftware AccessoriesSata Half-Height DVD-ROM Drive Optical Drives Removable Storage Diskette and Digital DrivesTechnical Specifications ROM Bios Information Http//env-webserver.ccm.cpqcorp.net/EMESC/default.htmAdditional Features Description Other Features DescriptionServiceability Features of System Serviceability Features of ChassisQuickSpecs Codec Audio Jacks Technical Specifications AudioHigh Definition Audio Type Technical Specifications Communications ASF, WOL, PXE, DMI, WFM Data Compression Power Management Output powerFax Mode Capabilities Error CorrectionEMC Ramdac Technical Specifications GraphicsBoard configuration Specification Description DVI-D ConnectorResolution Hz LCD 60-Hz 75-Hz 85-Hz ConnectorsLanguages supported Digital Resolution Maximum Refresh RateGS 256 MB DH PCIe Maximum vertical X1 Graphics Controller Refresh rate Display supportGraphics Card Refresh rate Display support ATI Radeon X1600XTMB DH FH PCIe Maximum vertical Head Memory Display resolutionNvidia Quadro NVS Form Factor 290 256MB PCIe Dual Bus TypeTechnical Specifications Hard Drives Cache 10,000 RPM Serial ATA 160-GB Hard Drives 80-GB CapacityEMI RFI Technical Specifications Input/Output DevicesESD Colors PS/2 Standard Physical KeysMechanical Languages HP USB Smartcard Physical KeysStandard APIs Supported PowerEnvironmental Smartcard function SupportUSA System requirements HP PS/2 Optical Scroll MouseESD EMI-RFI Technical Specifications Optical Storage DVD-ROM CD-R DVD-ROMCD-ROM DVD-RW, DVD+RW DVD+R/-R/+RWROM CD-ROM, CD-R DVD-R DL, DVD+R DLDVD+R, DVD-R DVD-ROM DL, DVDAccess time Random DVD Technical Specifications Removable Storage Declarations Technical Specifications Environmental DataEco-Label Upgrading Sound Power Sound PressureDeclared Noise Emissions LongevitySmall Form Factor with 80% Efficient Power Supply Not for systems containing 10,000 RPM hard drives Convertible Minitower with 80% Efficient Power Supply 1687 g End-of-life RoHS ComplianceMaterial Usage PackagingInformation Hewlett-PackardCorporate