Samsung DDR3 manual X X B X X X X X X X X X

General Information											DDR3 SDRAM
3. DDR3 SDRAM Module Ordering Information
1	2	3	4	5	6	7	8	9	10	11	12

M X X X B X X X X X X X - X X X

Memory Module

DIMM Type

Data bits

DRAM Component Type

Depth

#of Banks in Comp. & Interface Bit Organization

1.Memory Module : M

2.DIMM Type

3 : DIMM

4 : SODIMM

3.Data Bits

71 : x64 204pin Unbuffered SODIMM

78 : x64 240pin Unbuffered DIMM

91 : x72 240pin ECC unbuffered DIMM

92 : x72 240pin VLP Registered DIMM

93 : x72 240pin Registered DIMM

4.DRAM Component Type

B : DDR3 SDRAM (1.5V VDD)

Speed

Temp & Power

PCB Revision

Package

Component Revision

8. Component Revision
M	:	1st Gen.	A :		2nd Gen.
B	:	3rd Gen.	C	:	4th Gen.
D	:	5th Gen.	E	:	6th Gen.
F	:	7th Gen.	G :		8th Gen.

9. Package

Z	: FBGA(Lead-free)
H	: FBGA(Lead-free & Halogen-free)
J	: FBGA(Lead-free, DDP)

M: FBGA(Lead-free & Halogen-free, DDP)

10.PCB Revision

0	:	None	1	:	1st Rev.
2	:	2nd Rev.	3	:	3rd Rev.
4	:	4th Rev.	S :		Reduced Layer

5. Depth						11. Temp & Power
						C : Commercial Temp.( 0°C ~ 85°C) & Normal Power
32	:	32M	33	:	32M (for 128Mb/512Mb)
						Y		°	°
64	:	64M	65	:	64M (for 128Mb/512Mb)			: Commercial Temp.( 0 C ~ 85 C) & Low VDD(1.35V)
28	: 128M		29	: 128M (for 128Mb/512Mb)
56	: 256M		57 : 256M (for 512Mb/2Gb)			12. Speed
51	: 512M		52	: 512M (for 512Mb/2Gb)
1G :		1G	1K	: 1G (for 2Gb)		F7	: DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6)
2G :		2G	2K	: 2G (for 2Gb)
						F8	:	DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)
						H9 :		DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)
6. # of Banks in comp. & Interface						K0 :		DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)
7	:	8Banks & SSTL-1.5V
						Note: PC3-6400(DDR3-800),PC3-8500(DDR3-1066),
								PC3-10600(DDR3-1333), PC3-12800(DDR3-1600)

7. Bit Organization

0: x 4

3: x 8

4: x16

October 2009