Panasonic EE23 dimensions EB Series

Page 8

Aluminum Electrolytic Capacitor

2.4Flow Soldering

(1)Don not immerse the capacitor body into the solder bath as excessive internal pressure could result.

(2)Observe proper soldering conditions (temperature, time, etc.). Do not exceed the specified limits.

(3)Do not allow other parts or components to touch the capacitor during soldering.

2.6 Other Soldering Considerations

Rapid temperature rises during the preheat operation and resin bonding operation can cause cracking of the capacitor vinyl sleeve. For heat curing, do not exceed 150°C for a maximum time of 2 minutes.

2.5Reflow Soldering for Chip Capacitors

(1)For reflow, use a thermal conduction system such as infrared radiation (IR) or hot blast. Vapor heat transfer systems (VPS) are not recommended.

(2)Observe proper soldering conditions (temperature, time, etc.). Do not exceed the specified limits.

(3)Reflow should be performed one time. Consult us for additional reflow restrictions.

 

 

5(s)

(°C)

250

Peak

 

temperature

 

200

temperature

 

160°C

 

150

Time in

part

120(s)

100

200°C or more

upper

 

 

 

Parts

50

 

 

 

 

 

 

 

Time

 

 

 

 

Chip capacitor reflow guaranteed condition

(°C)

240

 

 

 

 

 

 

 

 

 

 

 

 

 

temperature

230

 

 

 

 

 

 

220

 

 

 

 

 

 

 

 

 

 

 

 

 

Peak

210

 

 

 

 

 

 

 

0

10

20

30

40

50

60

 

 

 

Time in 200°C or more (s)

 

 

 

 

 

(φ3 to 6.3φ)

 

 

(°C)

240

 

 

 

 

 

 

 

 

 

 

 

 

 

temperature

230

 

 

 

 

 

 

220

 

 

 

 

 

 

 

 

 

 

 

 

 

Peak

210

 

 

 

 

 

 

 

0

10

20

30

40

50

60

 

 

 

Time in 200°C or more (s)

 

 

 

 

 

(φ8 to φ10)

 

 

 

240

 

EB Series

 

 

(°C)

 

 

 

 

 

 

 

 

 

 

 

 

 

temperature

230

 

 

 

 

 

 

220

 

 

 

 

 

 

 

 

 

 

 

 

 

Peak

210

 

 

 

 

 

 

 

0

10

20

30

40

50

60

 

 

 

Time in 200°C or more (s)

 

 

 

 

 

(φ10 to

φ18)

 

 

2.7 Capacitor Handling after Soldering

(1)Avoid movement of the capacitor after soldering to prevent excessive stress on the leadwires where they enter the seal.

(2)Do not use the capacitor as a handle when moving the circuit board assembly.

(3)Avoid striking the capacitor after assembly to prevent failure due to excessive shock.

2.8Circuit Board Cleaning

(1)Circuit boards can be immersed or ultrasonically cleaned using suitable cleaning solvents for up

t o 5 m i n u t e s a n d u p t o 6 0 ° C m a x i m u m temperatures. The boards should be thoroughly rinsed and dried.

Recommended cleaning s o l v e n t s include Pine Alpha ST-100S, Sunelec B-12, DK Beclear CW-5790, Aqua Cleaner 210SEP, Cold Cleaner P3-375, Telpen Cleaner EC-7R, Clean-thru 750H, Clean-thru 750L, Clean thru 710M, Techno Cleaner 219, Techno Care FRW-17, Techno Care FRW-1, Techno Care FRV-1, IPA (isopropyl alcohol)

The use of ozone depleting cleaning agents are not recommended in the interest of protecting the environment.

(2)Avoid using the following solvent groups unless specifically allowed for in the specification;

Halogenated cleaning solvents: except for solvent

resistant capacitor types, halogenated solvents can permeate the seal and cause internal capacitor corrosion and failure. For solvent r e s i s t a n t c a p a c i t o r s , c a r e f u l l y f o l l o w t h e temperature and time requirements of the specificaion. 1-1-1 trichloroe thane should never be used on any aluminium electrolytic capacitor.

Alkali solvents: could attack and dissolve the aluminum case.

Petroleum based solvents: deterioration of the rubber seal could result.

Xylene: deterioration of the rubber seal could result.

Acetone: removal of the ink markings on the vinyl sleeve could result.

T e m p e r a t u r e m e a s u r i n g m e t h o d : M e a s u r e temperature in assuming quantitative production, by sticking the thermo-couple to the capacitor upper part with epoxy adhesives.

Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.

EE20

Mar. 2005

Image 8
Contents Specification Dimensions in mm not to scaleSeries FA Type a Explanation of Part NumbersCase size / Impedance / Ripple current V.DC10C +20C V.DC 16 1C 25 1EV.DC 50 1H 10 C +20 CV.DC 63 1J EE25Operating Temperature and Frequency Operating Temperature and Life ExpectancyCircuit Design Expected Life Estimate Quick Reference GuideFaliure mode Typical failure modes and their factorsProduction factor Application factor EE17Using Two or More Capacitors in Series or Parallel Capacitor Mounting Considerations6Electrical Isolation of the Capacitor Capacitor Handling TechniquesEB Series Long Term Storage Precautions for using capacitorsEmergency Procedures Capacitor Disposal EE22