| TABLE OF CONTENTS |
|
1. | GENERAL | 3 |
2. | DISASSEMBLY | 9 |
3. | ASSEMBLY OF MECHANISM DECK | 11 |
4. | MECHANICAL ADJUSTMENTS | 14 |
5.ELECTRICAL ADJUSTMENTS
Test Mode | 14 |
Tape Deck Section | 14 |
Tuner Section | 15 |
6.DIAGRAMS
17 | ||
Printed Wiring Board – MAIN Section | 21 | |
23 | ||
Printed Wiring Board – PANEL Section | 27 | |
Schematic Diagram – PANEL Section | 29 | |
7. | EXPLODED VIEWS | 33 |
8. | ELECTRICAL PARTS LIST | 36 |
Flexible Circuit Board Repairing
•Keep the temperature of the soldering iron around 270 ˚C dur- ing repairing.
•Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering or unsoldering.
Notes on chip component replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be dam- aged by heat.
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