LG Electronics 42CS669C-ZD Servicing Precautions, Electrostatically Sensitive ES Devices

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SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication.

NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1.Always unplug the receiver AC power cord from the AC power source before;

a.Removing or reinstalling any component, circuit board module or any other receiver assembly.

b.Disconnecting or reconnecting any receiver electrical plug or other electrical connection.

c.Connecting a test substitute in parallel with an electrolytic capacitor in the receiver.

CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2.Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe.

Do not test high voltage by "drawing an arc".

3.Do not spray chemicals on or near this receiver or any of its assemblies.

4.Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength)

CAUTION: This is a flammable mixture.

Unless specified otherwise in this service manual, lubrication of contacts in not required.

5.Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6.Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7.Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead.

Always remove the test receiver ground lead last.

8.Use with this receiver only the test fixtures specified in this service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4.Use only an anti-static type solder removal device. Some solder removal devices not classified as “anti-static” can generate electrical charges sufficient to damage ES devices.

5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

General Soldering Guidelines

1.Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.

2.Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3.Keep the soldering iron tip clean and well tinned.

4.Thoroughly clean the surfaces to be soldered. Use a mall wire- bristle (0.5 inch, or 1.25 cm) brush with a metal handle.

Do not use freon-propelled spray-on cleaners.

5.Use the following unsoldering technique

a.Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F)

b.Heat the component lead until the solder melts.

c.Quickly draw the melted solder with an anti-static, suction- type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit board printed foil.

6.Use the following soldering technique.

a.Allow the soldering iron tip to reach a normal temperature (500 °F to 600 °F)

b.First, hold the soldering iron tip and solder the strand against the component lead until the solder melts.

c.Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil.

CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d.Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.

Copyright ©2012 LG Electronics. Inc. All right reserved.

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LGE Internal Use Only

Only for training and service purposes

 

 

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Contents CHASSIS LD0AW SERVICE MANUALREAD THE SAFETY PRECAUTIONS IN THIS MANUAL http//aic.lgservice.comCONTENTS CONTENTSPRODUCT SAFETY SPECIFICATIONSAFETY PRECAUTIONS IMPORTANT SAFETY NOTICEGeneral Guidance Before returning the receiver to the customerSERVICING PRECAUTIONS Electrostatically Sensitive ES DevicesIC Remove/Replacement ReplacementSmall-Signal Discrete Transistor Removal/Replacement Power Output, Transistor Device Removal/ReplacementSPECIFICATION 4. Model General Specification1. Application range 3. Test method5. Component Video Input Y, CB/PB, CR/PR 6. RGB Input PC1 DTV Mode 7. HDMI Input PC/DTV2 PC Mode ADJUSTMENT INSTRUCTION 1. Application Range2. Designation 3. Main PCB check process3.1. ADC Process 3.2. EDID Download3.3. EDID data After downloading, have to adjust Tool Option again4. Total Assembly line process 4.1. Adjustment Preparation3.4. Function Check Manual W/B process using adjusts Remote control4.3. Outgoing condition Configuration 6.1. Signal TABLE6.2. Command Set 5. GND and HI-POT Test7. CI+ Key Download method 1. Power-up boot check TROUBLESHOOTINGNo No No No No 3. Analog TV Video 2. Digital TV VideoNo No No No 4. AV Video 5. Component VideoNo No No ok No6. SCART Video 7. RGB Video8. HDMI Video Check HDMI Cable conductors for damage or open conductor9. All Source Audio 10. Digital TV Audio 11. Analog TV Audio13. Component/ SCART Audio 12. AV Audio14. RGB Audio DIAGRAM BLOCKSide RearEXPLODED VIEW Only for training and service purposes GP3S7LRCopyright 2012 LG Electronics. Inc. All rights reserved LGE Internal Use OnlyNormal Power VDDCNormal DDR3FROM LIPS & POWER B/D PowerDET+3.3VNormal +1.5VDDRCONTROL IR & LED USBDIODES IC1450HDMI EEPROM HDMI1SIDEHDMI GP3S7LR20110324 HDMI8New Item Development RGB/SPDIF/PC/HPRS232C GP3S7LR RS232C9PINOnly for training and service purposes GP3S7LR DDR256 DDR3 1.5V By CAP - Place these Caps near MemoryIC1201-*1 K4B1G1646G-BCH9GP3S7LR SFLASH IC1401-*1GP3S7LR 20110511TUNERL GP4RGLOBALTUNERBLOCKGP3S7LR NTP7400 IC501 NTP-7400LFull Scart/ Comp1 GP3S7LR REAR JACKSIDE COMPONENT PHONE JACK New Item Developmen CI Region Option name of this page CISLOT because of Hong KongGP3S7LR PCMCI 10067972-0500LFGASKET SMD GASGP3 S7LR 20110324