LG Electronics 32LS5610/561T IC Remove/Replacement, Removal, Circuit Board Foil Repair

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IC Remove/Replacement

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the cir- cuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1.Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2.Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1.Carefully insert the replacement IC in the circuit board.

2.Carefully bend each IC lead against the circuit foil pad and solder it.

3.Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor

Removal/Replacement

1.Remove the defective transistor by clipping its leads as close as possible to the component body.

2.Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3.Bend into a "U" shape the replacement transistor leads.

4.Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device

Removal/Replacement

1.Heat and remove all solder from around the transistor leads.

2.Remove the heat sink mounting screw (if so equipped).

3.Carefully remove the transistor from the heat sink of the circuit board.

4.Insert new transistor in the circuit board.

5.Solder each transistor lead, and clip off excess lead.

6.Replace heat sink.

Diode Removal/Replacement

1.Remove defective diode by clipping its leads as close as pos- sible to diode body.

2.Bend the two remaining leads perpendicular y to the circuit board.

3.Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4.Securely crimp each connection and solder it.

5.Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor

Removal/Replacement

1.Clip each fuse or resistor lead at top of the circuit board hollow stake.

2.Securely crimp the leads of replacement component around notch at stake top.

3.Solder the connections.

CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connec- tions).

1.Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2.carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3.Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4.Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1.Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2.Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly con- nected to the affected copper pattern.

3.Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side.

Carefully crimp and solder the connections.

CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

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Contents SERVICE MANUAL CHASSIS LD21BREAD THE SAFETY PRECAUTIONS IN THIS MANUAL http//aic.lgservice.comSAFETY PRECAUTIONS CONTENTSSERVICING PRECAUTIONS SPECIFICATIONIMPORTANT SAFETY NOTICE SAFETY PRECAUTIONSElectrostatically Sensitive ES Devices SERVICING PRECAUTIONSReplacement IC Remove/ReplacementSmall-Signal Discrete Transistor Removal/Replacement Removal4. Model General Specification SPECIFICATION1. Application range 3. Test methodsymbolrate Symbolrate 4.0Msymbols/s to 7.2Msymbols/sDVB-S2 8PSK / QPSK 2 ~ 45Msymbol/s DVB-S QPSK 2 ~ 45Msymbol/s5.2. RGB Input PC - LS35/LS34/CS46 series models are not supported 5. Video resolutions 2D5.1. Component Input Y, CB/PB, CR/PR PCDVI 5.3. HDMI InputPC/DTVBoot file Download ADJUSTMENT INSTRUCTION1. Application Range 2. Designation3.3. EDID data 3.1. ADC Process3.2. EDID Download 7. ADC Calibration3.4 Function Check 4. Total Assembly line process4.1. Adjustment Preparation 6.1. Signal Table 4.3. Outgoing condition Configuration5. HI-POT Test 6. Model name & Serial number D/L6.3. Method & notice 7. MAC Address & CI+ key download7.1 MAC Address GP4LOW7.3. LAN PORT INSPECTIONPING TEST 7.2 LAN InspectionScrew specification and application situation SCREW ASSEMBLY WORKING GUIDEח ͷͲͳͤͤͤͪͥͣ͢͡ ͙;ͤ͛ͽͥͦ͑͟͝ͳͼ͑͝;ΒΔΙΚΟΖ͚ ח ͣ͢ͶͲ ח ͷͲͳͤͨͩͩͣ͑͢͡͡ ͙;ͧ͛ͽ͑͢͡͝ͳͼ͑͝;ΒΔΙΚΟΖ͚Side RearLG2111 A IC101LS350T/CS460T Applied Model **LM580T, **560T, **LS350T, **CS460TTDSN G301DG001D 560S, **LS350S, **CS460SLS350S/CS460S EXPLODED VIEW Copyright 2012 LG Electronics. Inc. All rights reserved GP4LS7LR22011.12.01to delete CI or gate for for SYSTEM EEPROMVDDC Normal PowerNormal DDR3PowerDET FROM LIPS & POWER B/D+3.3VNormal +1.5VDDRIR/LED and control for normal models USB2DIODES USB SIDEUSB1DIODES HDMI THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES RGB-PC / SPDIFSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISFor Comsumer model, use 4PIN Wafer RS-232CCOMMERCIAL/NonOS MODEL OPTION COMMERCIAL MODEL OPTION LVDS for large inch GP4LS7LR22011/06/03 DDR25612 S7LR2DIVXMS10IC1201 H5TQ1G63DFR-H9CSFLASHMAINWINBOND IC1401-*1 W25Q80BVSSIG Serial Flash for SPI bootSFLASHMAINMACRONIX HEAD Headphone *Option HEADPHONEPHONE 10067972-0500LF CI RegionOption name of this page CISLOT because of Hong Kong ETHERNET H/W option ETHERNETGP4LS7LR22011/06/14 ETHERNET21 TU2602TU2603 TDSS-G101D TDSN-G301D GP4RGLOBALTUNERBLOCKTU2601 TDSQ-G001DOptionLNB DVB-S2 LNB Part AllegroGP4LS7LR22011/11/02 DVBS27 DCDCGND and AGND are connectedFULL SCART / COMPONENT1 SCART / COMPONENT&COMPSITJK2801 PSC008-01AUDIO AMPSTA380BWE Page Contents of LCD TV Standard Repair Process Continue to the next page Contents of LCD TV Standard Repair Process Detail Technical ManualError symptom ContentLCD TV A. Video errorMain B/D↔ Power B/D, LVDS Cable,Speaker Cable,IR B/D Cable A2 Check Power Board 24v outputCheck various voltages of PowerBoard 3.5V,12V,20V or 24V…Signal Quality Normal over 50% By using Digital signal level meter By using Diagnostics menu on OSDMenu→ Set up→ Support → Signal Test Signal strength Normal over 50% → Set-Top-Box, Different maker TV etc Check color by input -External Input COMPONENT -RGB A8/ A9※ Check Link CableVertical/Horizontal bar, residual image, light spot External device screen error-Color errorConnect other external device and cable Check color condition by input -External Input -Component RGBCheck Power LED B. Power errorCheck Power On ‘”High” Measure voltage of each output of Power B/DIf Power Off mode is not displayed Check Power B/D voltage Check Power Off ModePOWEROFFABNORMAL1 POWEROFFCPUABNORMAL24V of Power C. Audio errorCheck user menu Speaker off Check audio B+Check audio B+ Voltage In case of External Input signal error Check and fix external deviceCheck & Repair D. Function error1. Remote controlR/C operating error Y Check technical Signal information input? - Fix information Check input signalRecognition error Replace Main B/DIdentify nose type E. NoiseF. Exterior defect